Artificial Nail Composition with Controlled Cross-Link Density

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Solution Overview

Problem

Existing artificial nail compositions that provide strong adhesiveness to nails are difficult to remove due to their cross-linked structure, and previous solutions either require mechanical removal or use acidic solutions that can damage nails or skin.

Innovation Solution

A composition containing an acrylamide compound with a molecular weight of 150-250 and a multifunctional polymerizable compound at 15-35% by mass, which is curable and provides both strong adhesiveness and safe removability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a cross-linked structure is used to improve close adhesiveness with nails, then adhesiveness is improved, but removability deteriorates

Engineering Contradiction:
Improveclose adhesivenessVSAvoidremovability
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The patent changes the chemical composition parameters by incorporating specific monomers (acrylamide compound with molecular weight 150-250, multifunctional polymerizable compound at 15-35% by mass) that create a cross-linked structure with controlled density. This allows the cured product to maintain strong adhesiveness while remaining removable by organic solvents, resolving the contradiction between bond strength and ease of removal.

Inventive Principle:
Principle #35Parameter changes

2Ease of operation

If mechanical removal by sanding or nail machine is used to remove artificial nails, then removability is improved, but nail and skin damage occurs

Engineering Contradiction:
ImproveremovabilityVSAvoidnail and skin damage
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical removal system (sanding, nail machines) with a chemical removal system using organic solvents. The composition is designed to be soluble in organic solvents while maintaining strong adhesion to nails, allowing non-mechanical removal that avoids damage to natural nails and skin.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Ease of operation

If acidic aqueous solution is used to remove artificial nails, then removability is improved, but nail and skin damage occurs

Engineering Contradiction:
ImproveremovabilityVSAvoidnail and skin damage
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent changes the chemical nature of the removal system from acidic aqueous solution to organic solvent-based removal. The composition is specifically designed to be soluble in organic solvents rather than requiring acidic conditions, eliminating the harmful effects of acid on nails and skin while maintaining effective removability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition allows for easy removal with an organic solvent while maintaining strong adhesiveness to nails, avoiding mechanical scraping and skin/nail damage.

Implementation Method 1

an acrylamide compound (A1) having a molecular weight of 150 or greater but 250 or less and a multifunctional polymerizable compound (A2)

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS12023398B2Composition, artificial nail composition, nail decoration material, artificial nail, stored container, image forming apparatus, and image forming method
Publication Date: 2024.07.02 RICOH CO LTD
  • US12023398B2 patent drawing
  • US12023398B2 patent drawing
  • US12023398B2 patent drawing

AI summary

Provided is a composition including: an acrylamide compound (A1) having a molecular weight of 150 or greater but 250 or less; and a multifunctional polymerizable compound (A2), wherein a content of the multifunctional polymerizable compound (A2) is 15% by mass or greater but 35% by mass or less.