ASIC Cooling Control Using Temperature History and Lifetime Prediction

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Solution Overview

Problem

High-end routing and switching systems face cooling challenges due to concentrated heat in application-specific integrated circuits (ASICs), where traditional temperature control methods fail to maintain long-term ASIC reliability without throttling data traffic.

Innovation Solution

A method that calculates the expected life of hardware devices using historical temperature measurements to adjust cooling parameters, such as fan speed and data throughput, to maintain desired lifespan while optimizing power usage and performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If traditional temperature control algorithms run fan speed and throttle data traffic based solely on ambient temperature or junction temperatures, then cooling response is fast, but hardware device lifetime is reduced due to excessive cooling at low temperatures and insufficient cooling at high temperatures

Engineering Contradiction:
Improvecooling response speedVSAvoidhardware device lifetime
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The system calculates the expected lifetime of the hardware device in advance based on historical temperature measurements and current temperature, then uses this pre-calculated lifetime information to guide cooling decisions. This allows the system to proactively adjust cooling parameters before thermal damage occurs, rather than reactively responding to temperature thresholds.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system implements a feedback mechanism where temperature measurements are continuously collected, expected lifetime is recalculated based on accumulated data, and cooling parameters are dynamically adjusted. The feedback loop connects temperature sensing, lifetime prediction, and cooling control to optimize both response speed and device longevity.

Inventive Principle:
Principle #23Feedback

2Temperature

If fan speed is increased to cool the ASIC, then temperature is reduced, but power consumption increases and noise increases

Engineering Contradiction:
ImproveASIC temperatureVSAvoidfan power consumption
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The fan speed is made dynamic rather than static, adjusting continuously based on the calculated expected lifetime and current temperature conditions. The system transitions from fixed-speed operation to variable-speed control, optimizing power consumption by running the fan at the minimum necessary speed to achieve desired lifetime targets.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes the operating parameter of the fan from fixed speed to variable speed controlled by the lifetime calculation algorithm. By modifying the fan speed parameter dynamically based on thermal history and expected lifetime, the system achieves temperature control with optimized power consumption.

Inventive Principle:
Principle #35Parameter changes

3Temperature

If data traffic is throttled to reduce ASIC temperature, then temperature is controlled, but productivity decreases

Engineering Contradiction:
ImproveASIC temperatureVSAvoiddata throughput
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The system performs preliminary lifetime calculation to determine how much thermal margin is available before device failure. This advance knowledge allows the system to maintain data traffic at high levels when thermal conditions permit, only throttling when absolutely necessary to preserve device lifetime.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

Instead of completely throttling data traffic when cooling is needed, the system applies partial throttling only to the extent necessary to achieve the desired lifetime target. The algorithm calculates the minimum required throttling to preserve device longevity while maintaining maximum possible productivity.

Inventive Principle:
Principle #16Partial or excessive action

4Temperature

If advanced heatsinks and fans are used to cool ASICs, then cooling capability is improved, but device complexity increases and cost increases

Engineering Contradiction:
ImproveASIC cooling capabilityVSAvoidcooling system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The cooling system uses intelligent control algorithms that enable the existing cooling components to optimize their own operation based on real-time temperature data and lifetime calculations. The system self-adjusts cooling parameters without requiring additional complex hardware, making the existing cooling infrastructure work more efficiently.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The system optimizes the operating parameters of existing cooling components (fan speed, heatsink airflow) through intelligent control rather than adding more complex cooling hardware. By changing operational parameters dynamically, the system achieves better cooling performance without increasing device complexity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively extends the life of hardware devices by optimizing temperature management based on historical data, reducing premature failures and lowering operational costs while maintaining performance.

Implementation Method 1

decreasing the temperature of the hardware device by changing an operating parameter of a cooling element

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS11429093B2Hardware device temperature control with expected lifetime calculation
Publication Date: 2022.08.30 CISCO TECHNOLOGY INC
  • US11429093B2 patent drawing
  • US11429093B2 patent drawing
  • US11429093B2 patent drawing

AI summary

Embodiments herein describe coupling traditional fan and shaper control along with aggregated knowledge of the temperature history of a hardware device to optimally manage the temperature of the hardware device to preserve its expected life while also providing the lower power, best performing solution possible. In one embodiment, a cooling application manages the expected life by trading off performance and power versus temperature to achieve a desired (or accepted) lifetime. In one embodiment, the cooling application calculates a historical temperature value for the hardware device which is then used to determine the expected life of the hardware device.