ASIC and Silicon Photonics Copackaging Thermal Management
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Solution Overview
Problem
Designing a module with electronic and optical components that effectively manages power distribution, heat dissipation, and maintains a benign temperature range for photonic integrated circuits while keeping power conductors short and reducing voltage drops.
Innovation Solution
A module with a substrate having conductive traces and multiple contact types, including wire bond pads and solder connections, that securely integrates electronic and photonic integrated circuits with a thermal path for efficient heat removal and temperature control, using an organic substrate and a metal cover with a low thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the electronic integrated circuit is placed on the substrate with conventional packaging, then the module structure is simple, but the power conductors become long causing voltage drops
Solution Approach 1:
The electronic integrated circuit is positioned to extend beyond the substrate plane in the vertical dimension, with portions of the bottom surface overhanging the substrate edges. This spatial arrangement allows power and signal contacts to be made directly at the overhanging edges, dramatically shortening the power conductor length from the traditional horizontal routing through the substrate to vertical or edge-mounted connections.
2Ease of manufacture
If the electronic integrated circuit is placed on the substrate with conventional packaging, then the assembly process is simple, but heat dissipation from the electronic integrated circuit is insufficient
Solution Approach 1:
The electronic integrated circuit is extracted from the conventional planar arrangement on the substrate and repositioned to overhang the substrate edges. This extraction creates direct access to the bottom surface of the electronic integrated circuit, allowing thermal management components to be applied directly to the heat-generating surfaces without intervening substrate layers, thereby significantly improving heat dissipation efficiency.
3Device complexity
If the photonic integrated circuits are placed on the substrate, then the module structure is compact, but the temperature range becomes unfavorable for photonic operation
Solution Approach 1:
The substrate serves as a thermal intermediary between the electronic integrated circuit (which generates heat) and the photonic integrated circuits (which require stable, benign temperatures). By positioning the electronic circuit to overhang the substrate rather than being embedded within it, the substrate acts as a thermal buffer that isolates the photonic circuits from direct thermal coupling with the electronic circuit, maintaining favorable temperature ranges for photonic operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient power distribution, effective heat dissipation, and controlled temperature management, ensuring optimal performance of both electronic and photonic integrated circuits while maintaining compact power conductor lengths.
Implementation Method 1
each contact of the first plurality of contacts is secured to a contact of the second plurality of contacts with solder
Implementation Method 2
a thermal path, with a thermal resistance of less than 0.1° C./W, between the bottom surface of the electronic integrated circuit and an exterior surface of the upper cover
Data Source
AI summary
A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.