Electronic Assembly Heat Dissipation Plate
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Solution Overview
Problem
The high level of miniaturization in electronic devices leads to localized heat generation, which is not adequately dissipated, causing operating temperatures to exceed optimal ranges, especially in power electronic devices, resulting in reduced performance and lifespan.
Innovation Solution
An electronic assembly design where a semiconductor chip is mounted with a heat-dissipation plate exposed on one main surface and contact elements on the same surface, allowing direct heat dissipation into the environment without the need for additional thermal coupling to a PCB, and optionally coupled with a heat sink for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electronic device is miniaturized to reduce physical size, then the device footprint and weight are reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent transitions from planar heat dissipation (on the PCB surface) to three-dimensional heat dissipation by exposing the dissipation plate on the lateral surface of the package. This allows heat to be dissipated in multiple spatial directions simultaneously, improving thermal management while maintaining compact footprint.
Solution Approach 2:
The patent separates the dissipation plate from the PCB mounting surface, allowing it to be independently exposed on the lateral surface. This segmentation enables the dissipation plate to function as an independent thermal management component rather than being constrained by the PCB plane.
2Temperature
If a heat sink is mounted on the PCB opposite to the mounting surface to improve heat dissipation, then thermal management is enhanced, but the space available for mounting other electronic devices is reduced
Solution Approach 1:
The patent extracts the heat dissipation function from the PCB plane by exposing the dissipation plate on the package's lateral surface. This removes the conflict between heat sink mounting and device placement area, as thermal management is achieved through the package structure itself rather than through PCB modifications.
3Temperature
If the dissipation plate is thermally coupled to the PCB through metallic through holes to improve heat dissipation, then thermal exchange is enhanced, but the cost and weight of the electronic circuit increase
Solution Approach 1:
The package structure itself serves the dual function of housing the semiconductor chip and providing heat dissipation through the exposed dissipation plate. The insulating material with thermal conductivity is integrated into the package structure, eliminating the need for separate heavy thermal management components on the PCB.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively manages heat dissipation, maintaining compactness while preventing heat buildup, allowing electronic devices to operate within optimal temperature ranges and extending their lifespan.
Implementation Method 1
a dissipation plate thermally coupled to said chip to dissipate the heat produced by it
Data Source
AI summary
An embodiment of an electronic assembly for mounting on an electronic board includes a plurality of electric contact regions exposed on a mounting surface of the electronic board. The electronic assembly includes a chip of semiconductor material in which at least one electronic component is integrated, at least one support element including a first main surface and a second main surface opposite to the first main surface, the chip being enclosed by the at least one support element, a heat dissipation plate thermally coupled to said chip to dissipate the heat produced by it, exposed on the first main surface of the support element, a plurality of contact elements, each electrically coupled to a respective electric terminal of the electronic component integrated in the chip, exposed on the same first main surface of which is exposed to the dissipation plate. Also included are a plurality of electric connection elements, each adapted to electrically intercouple a respective contact element of the electronic assembly with a corresponding electric contact region of the electronic board, in such a way that the second main surface of the at least one support element faces the mounting surface of the electronic board.