Assembly Substrate with Segmented Frame for Warpage Suppression
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Solution Overview
Problem
Conventional methods for manufacturing multilayer printed circuit boards result in warpage and poor substrate strength due to stress during insulation layer formation, leading to handling difficulties and reduced productivity and economic efficiency.
Innovation Solution
A substrate with a frame body surrounding individual substrates, featuring concave portions along its inner periphery, enhances mechanical strength isotropically and suppresses warpage, allowing for easier handling and separation while maintaining substrate strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a frame-like conductive pattern is provided discontinuously to reduce cost, then manufacturing cost is reduced, but substrate strength deteriorates and handling becomes difficult
Solution Approach 1:
The frame body is segmented into multiple concave portions arranged in parallel along the inner periphery, creating multiple reinforcement zones that collectively provide isotropic strength enhancement without requiring a complete continuous frame structure
Solution Approach 2:
The frame body provides localized reinforcement at specific positions (concave portions) rather than uniform reinforcement throughout, optimizing material usage while achieving sufficient substrate strength and warpage suppression
2Productivity
If the work board becomes thinner and has a larger area to increase substrate count, then productivity is improved, but substrate strength deteriorates and handling becomes more difficult
Solution Approach 1:
The frame body adds structural support in the vertical dimension (thickness direction) through its raised structure, compensating for the reduced substrate thickness while maintaining large area for high substrate count
Solution Approach 2:
The frame body acts as a composite structural element combining the substrate material with reinforcing frame material, creating a hybrid structure that enhances overall strength without significantly increasing weight or volume
3Ease of manufacture
If frame-like conductive pattern is removed after separation to reduce cost, then manufacturing cost is reduced, but warpage suppression capability deteriorates
Solution Approach 1:
The frame body is formed in advance during substrate manufacturing and maintains its structure through the separation process, providing continuous warpage suppression capability from manufacturing through to final product without requiring post-separation frame removal
4Device complexity
If conventional manufacturing method is used to produce work boards, then existing processes can be utilized, but handling difficulty and warpage occur during transfer and separation
Solution Approach 1:
The concave portions of the frame body create curved geometric features that facilitate grip and handling during transfer and separation operations, improving ease of operation while maintaining structural integrity
Data Source
AI summary
The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).