Asymmetric Binary Exposure Mask for Curved Surface Profiles
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Solution Overview
Problem
Existing methods for forming pattern profiles with curved surfaces using multiple exposure masks and gradation masks are time-consuming and costly due to the need for repeated lithography and etching processes.
Innovation Solution
A binary exposure mask with asymmetrically arranged pattern blocks, each comprising pattern units with varying shapes and materials, allowing for one-time lithography and etching fabrication, thereby simplifying the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple exposure masks are used to form pattern profiles with curved surfaces, then the desired complex patterns can be achieved, but the processing time and overall cost increase significantly
Solution Approach 1:
The exposure mask is divided into multiple pattern blocks, each containing pattern units with different transmission characteristics. This segmentation allows complex curved surface patterns to be formed in a single exposure step by combining multiple pattern elements on one mask, eliminating the need for multiple sequential exposures while maintaining the ability to create complex three-dimensional photoresist profiles
Solution Approach 2:
The patent transitions from traditional two-dimensional planar masks to three-dimensional pattern blocks with varying light transmission depths. By introducing the depth dimension through different thicknesses of light-blocking layers, the mask can encode multiple pattern layers and curved surface information simultaneously, enabling complex 3D pattern formation in a single exposure step
2Adaptability or versatility
If gradation mask method is used to form pattern profiles with curved surfaces, then the light transmission can be controlled, but more fabrication steps are required to create the light-blocking layer with different thicknesses
Solution Approach 1:
The mask structure is segmented into distinct pattern blocks, each containing light-blocking layers of specific thicknesses arranged in asymmetric configurations. This segmentation provides controllable light transmission for different pattern regions while maintaining a relatively simple single-step lithography and etching fabrication process, avoiding the need for repeated fabrication steps required by traditional gradation masks
3Ease of manufacture
If traditional symmetric arrangement of pattern units is used, then the fabrication process is simpler, but the ability to form complex curved surface profiles is limited
Solution Approach 1:
The patent employs asymmetric arrangement of pattern units within pattern blocks, where the spatial configuration and light-blocking layer thicknesses are deliberately made non-uniform. This asymmetry enables precise control over light transmission patterns, allowing accurate formation of complex curved surface profiles while still being achievable through standard single-step lithography and etching processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces processing time and overall cost by eliminating the need for repetitive fabrication steps while effectively forming complex pattern profiles with curved surfaces.
Implementation Method 1
the amount of light transmission depends on the thickness of the light-blocking layer on the (gradation) exposure mask
Data Source
Figure 1
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Figure 3A~3G
AI summary
An exposure mask is provided. The exposure mask includes a plurality of pattern blocks for defining a plurality of pattern profiles. Each pattern block includes a plurality of pattern units having mask patterns, and the mask patterns are formed in an asymmetric arrangement. The exposure mask may be a binary exposure mask for forming pattern profiles with curved surfaces.