Asymmetric Brim Lid for Semiconductor Chip Heat Dissipation
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Solution Overview
Problem
Existing semiconductor devices with lids mounted on electronics apparatuses face challenges in minimizing mounting area and reducing mounting height, particularly when equipped with high-speed semiconductor chips that require effective heat release.
Innovation Solution
A semiconductor device configuration featuring two rectangular semiconductor chips flip-chip mounted on a quadrangular wiring substrate with a cover member, where the cover member includes wider brims along certain sides to minimize the mounting area and enhance heat dissipation through thermal conductive adhesive agents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a lid is added to release heat from semiconductor chips, then heat dissipation is improved, but mounting area and mounting height increase
Solution Approach 1:
The lid is designed with asymmetric brim widths where the first brim has a first width and the second brim has a second width different from the first width. This asymmetric design allows optimized heat dissipation paths while minimizing the overall mounting area footprint on the wiring substrate.
Solution Approach 2:
Different regions of the lid are designed with different brim widths to serve different functions - the first brim with first width and the second brim with second width. This local differentiation optimizes both heat dissipation efficiency and space utilization in different areas of the package.
2Temperature
If a lid is added to release heat from semiconductor chips, then heat dissipation is improved, but mounting height increases
Solution Approach 1:
The asymmetric brim design allows the lid to achieve effective heat dissipation coverage without requiring uniform increases in all dimensional directions, thereby controlling the overall mounting height while maintaining thermal performance.
3Speed
If semiconductor chips are flip-chip mounted for high-speed processing, then signal transmission speed is improved, but heat generation increases
Solution Approach 1:
The lid structure converts the harmful heat generated by high-speed flip-chip mounted semiconductor chips into a manageable thermal flow path. The asymmetric brims are designed to channel and dissipate the heat effectively, transforming the heat problem into a controlled thermal management solution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the mounting area and height of the semiconductor device while effectively releasing heat from high-speed semiconductor chips, improving the reliability and noise reduction in high-speed signal transmission.
Implementation Method 1
enhance heat dissipation through thermal conductive adhesive agents
Data Source
AI summary
The long sides of a rectangular control chip and the long sides of a rectangular memory chip are arranged parallel with first sides of the upper surface of a wiring substrate in a BGA. A lid includes a pair of first brims and a pair of second brims, the widths of the second brims are formed wider than those of the first brims, and a mounting area for mounting chip parts and a junction base area for joining the lid are secured outside the short sides of the control chip mounted on the upper surface of the wiring substrate and outside the short sides of the memory chip mounted on the upper surface of the wiring substrate, which enables the wide-width second brims of the lid to be disposed on the junction base area. Hence, the mounting area of the BGA can be reduced.