Asymmetric Chip Pad Structure for Reliable Display Module Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The reliability of the connection between a chip and a circuit board in a display module is a critical issue affecting bonding yield, necessitating improvements in electrical connectivity.
Innovation Solution
A chip design featuring junctions with varying sub-junctions, where the first sub-junction has a greater width than the second sub-junction, arranged in a specific configuration to enhance bonding area and reliability, compatible with both hard and flexible circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chip uses uniform junctions for connection, then the manufacturing process is simple, but the bonding yield and connection reliability are insufficient
Solution Approach 1:
The junction is divided into multiple sub-junctions (first sub-junction, second sub-junction, third sub-junction) with different widths. This segmentation allows each sub-junction to serve different bonding functions, improving overall bonding yield while managing structural complexity through functional division.
Solution Approach 2:
Different sub-junctions are designed with different widths to match different bonding requirements. The first sub-junction has a width matching the first bonding area, the second sub-junction matches the second bonding area, and so on. This local quality differentiation optimizes bonding reliability for each specific connection point.
2Reliability
If the chip uses larger junctions to improve bonding area, then the bonding reliability improves, but the chip area occupied increases
Solution Approach 1:
Instead of using a single large junction, the bonding area is segmented into multiple smaller sub-junctions with different widths. This allows the total bonding area to be distributed efficiently across the chip surface, improving connection reliability without excessively increasing the chip area occupied by any single junction structure.
Solution Approach 2:
The sub-junctions are designed with asymmetric width variations rather than uniform dimensions. This asymmetric design allows optimal use of chip area by matching each sub-junction's width to its specific bonding requirements, maximizing connection reliability while minimizing overall area consumption.
3Adaptability or versatility
If the chip is designed for specific circuit board types, then the connection precision is high, but the adaptability to different circuit boards is reduced
Solution Approach 1:
The chip junction is designed with multiple sub-junctions of different widths that can accommodate various bonding area sizes. This multi-functional design allows the same chip structure to be adapted to different circuit board types (hard circuit boards, flexible circuit boards, etc.) while maintaining bonding precision through the appropriate selection and combination of sub-junctions for each specific application.
Data Source
AI summary
The disclosure provides a chip and a display module with the same. The chip comprises a body, wherein the body is provided with a plurality of junctions which are arranged at intervals in a first direction, at least one junction comprises a first sub-junction and a second sub junction which are arranged in a second direction and formed into an integrated structure, a width of the first sub-junction is greater than a width of the second sub-junction in the first direction, and the second direction is perpendicular to the first direction.