Asymmetric Coupling Ring for Uniform Deposition
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Solution Overview
Problem
As semiconductor wafers increase in size, existing deposition apparatuses face challenges in achieving uniform processing, leading to inconsistencies in thin film deposition across the substrate.
Innovation Solution
A substrate support unit with a coupling ring having an asymmetric cross-section and an arm part for raising and lowering the coupling ring, which includes regions of different thicknesses to uniformly distribute electric fields and improve gas flow, ensuring consistent thin film deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional substrate support unit with a uniform coupling ring is used, then the structure is simple and easy to manufacture, but the electric field distribution is non-uniform and thin film deposition is inconsistent across the substrate
Solution Approach 1:
The coupling ring is designed with an asymmetric cross-section where the thickness varies around its circumference. Specifically, the thickness at the position facing the gas injection unit is greater than the thickness at other positions. This asymmetric design creates a more uniform electric field distribution across the substrate surface, resulting in consistent thin film deposition throughout the substrate area.
Solution Approach 2:
Different regions of the coupling ring are given different thicknesses to serve specific local functions. The thicker region facing the gas injection unit provides better electric field shielding and more stable plasma generation, while the thinner regions allow for optimized gas flow and heat dissipation. This local differentiation of properties enables uniform thin film deposition across the entire substrate.
2Manufacturing precision
If the coupling ring thickness is increased to improve electric field distribution, then the electric field uniformity improves, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
Rather than uniformly increasing the thickness of the entire coupling ring, the design applies asymmetric thickness variation where only specific portions of the coupling ring are thicker. This approach achieves the necessary electric field uniformity while minimizing the overall material usage and manufacturing complexity compared to a uniformly thick design.
3Productivity
If semiconductor wafers are increased in size to handle larger substrates, then the processing capacity increases, but achieving uniform processing across the entire substrate becomes more difficult
Solution Approach 1:
The asymmetric coupling ring design creates a more uniform electric field distribution that extends across larger substrate areas. By positioning the thicker portion of the coupling ring to face the gas injection unit, the electric field and plasma distribution are optimized for large-scale substrates, ensuring consistent thin film deposition from center to edge even as substrate sizes increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the uniformity of electric field distribution and thin film thickness across the substrate, improving process reliability and reducing variations in film deposition, even as substrate sizes grow.
Implementation Method 1
the coupling ring has an asymmetric cross-section with respect to a central axis thereof... uniformly distribute electric fields
Data Source
AI summary
A substrate support unit according to an example embodiment of the present inventive concept may include a support having an upper surface on which a substrate is disposed; a coupling ring on which an edge of the substrate is disposed, the coupling ring being having an annular shape, wherein the coupling ring is disposed on an edge of the support; and an arm part for raising and lowering the coupling ring and the substrate, wherein the arm part is disposed below the coupling ring and under a portion of the coupling ring, wherein the coupling ring has a first region disposed on the arm part and a second region disposed around the first region, wherein the first region has a thickness greater than that of the second region.