Asymmetric Dual-Side Semiconductor Module for Low-Stress Cooling
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Solution Overview
Problem
Existing power semiconductor packages face challenges in efficiently managing heat and reducing stress on components due to their stacked configuration and traditional heat sink designs.
Innovation Solution
The implementation of a semiconductor package design featuring a dual side cooling capability with asymmetrically coupled substrates through a lead frame and spacers, which reduces stress and improves heat dissipation by exposing the second side of each substrate as a heatsink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates are stacked in a traditional configuration, then the package structure is compact, but stress on components increases and heat dissipation is insufficient
Solution Approach 1:
The patent transitions from a traditional vertical stacked configuration to a dual-sided planar arrangement where substrates are coupled to opposite sides of a lead frame. This dimensional change allows heat dissipation surfaces to be exposed on both sides of the package, reducing thermal accumulation while maintaining structural compactness through the lead frame's intermediary positioning.
Solution Approach 2:
The patent employs asymmetric coupling where the first and second substrates are positioned on opposite sides of the lead frame with their perimeters partially overlapping. This asymmetric arrangement optimizes stress distribution by preventing direct alignment of substrate edges, thereby reducing mechanical stress concentration while enabling dual-sided heat dissipation.
2Temperature
If traditional heat sink designs are used, then the structure is simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The lead frame serves multiple functions: it mechanically couples the substrates, provides electrical connectivity, and acts as a structural support that enables dual-sided heat dissipation. By making the lead frame multi-functional, the patent eliminates the need for separate heat sink components while achieving superior thermal management through exposed heat dissipation surfaces on both sides of the package.
3Strength
If substrates are fully overlapping when coupled, then the connection is strong, but stress concentration increases
Solution Approach 1:
The patent specifies that the perimeters of the first and second substrates partially overlap rather than fully overlapping. This asymmetric partial overlap maintains sufficient mechanical strength through the lead frame coupling while distributing stress more evenly across the substrate connections, preventing stress concentration that would occur with full overlap alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces stress on components and enhances heat dissipation, improving the overall performance and reliability of power semiconductor packages.
Implementation Method 1
a lead frame between the first substrate and the second substrate
Implementation Method 2
a molding compound encapsulating the lead frame
Implementation Method 3
A second side of each of the first substrate and the second substrate may be exposed through the molding compound... a heat sink coupled with the second side of the first die, the second side of the second die
Data Source
AI summary
Implementations of semiconductor packages may include a first substrate having two or more die coupled to a first side, a clip coupled to each of the two or more die on the first substrate and a second substrate having two or more die coupled to a first side of the second substrate. A clip may be coupled to each of the two or more die on the second substrate. The package may include a lead frame between the first substrate and the second substrate and a molding compound. A second side of each of the first substrate and the second substrate may be exposed through the molding compound. A perimeter of the first substrate and a perimeter of the second substrate may not fully overlap when coupled through the lead frame.