Asymmetric Second Electrode Layer for Memory Device Field Control

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Solution Overview

Problem

Existing semiconductor memory devices face challenges in achieving high element density due to poor electric field distribution during erasing and programming, leading to memory window degradation.

Innovation Solution

A semiconductor structure comprising a first electrode layer, a second electrode layer, and a dielectric layer, where the second electrode layer's width increases away from the dielectric layer and its dopant concentration decreases towards it, improving electric field distribution and carrier injection/trapping during memory operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If 3D stack memory device is used to increase memory capacity and element density, then memory capacity and cost per cell are improved, but electric field distribution during erasing and programming deteriorates, leading to memory window degradation

Engineering Contradiction:
Improvememory capacityVSAvoidmemory window
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent applies local quality by creating a non-uniform dopant concentration distribution within the second electrode layer. The dopant concentration is higher at regions farther from the dielectric layer and lower at regions closer to it, which locally optimizes the electric field distribution during programming and erasing operations. This gradient structure allows different regions of the electrode to have different electrical properties, improving overall memory window while maintaining high density.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs asymmetry by designing the second electrode layer with an irregular width profile where the width varies in the direction away from the dielectric layer. This asymmetric geometry creates a more favorable electric field distribution compared to a uniform width structure, addressing the memory window degradation issue while preserving the high capacity benefits of 3D stacking.

Inventive Principle:
Principle #4Asymmetry

2Quantity of substance

If 3D stack memory device is used to increase element density, then element density is improved, but electric field distribution during programming deteriorates

Engineering Contradiction:
Improveelement densityVSAvoidelectric field distribution
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent applies local quality by creating a non-uniform dopant concentration distribution within the second electrode layer. The dopant concentration is higher at regions farther from the dielectric layer and lower at regions closer to it, which locally optimizes the electric field distribution during programming and erasing operations. This gradient structure allows different regions of the electrode to have different electrical properties, improving overall memory window while maintaining high density.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs parameter changes by modifying the dopant concentration parameter throughout the second electrode layer. By creating a gradient where dopant concentration varies with position (higher farther from dielectric, lower closer to dielectric), the electrical characteristics are optimized to improve electric field distribution during programming operations while maintaining high element density.

Inventive Principle:
Principle #35Parameter changes

3Quantity of substance

If 3D stack memory device is used to increase memory capacity, then memory capacity is improved, but electric field distribution during erasing deteriorates

Engineering Contradiction:
Improvememory capacityVSAvoidelectric field distribution
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent applies local quality by creating a non-uniform dopant concentration distribution within the second electrode layer. The dopant concentration is higher at regions farther from the dielectric layer and lower at regions closer to it, which locally optimizes the electric field distribution during programming and erasing operations. This gradient structure allows different regions of the electrode to have different electrical properties, improving overall memory window while maintaining high density.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs asymmetry by designing the second electrode layer with an irregular width profile where the width varies in the direction away from the dielectric layer. This asymmetric geometry creates a more favorable electric field distribution compared to a uniform width structure, addressing the memory window degradation issue while preserving the high capacity benefits of 3D stacking.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances memory window size by optimizing electric field distribution and carrier behavior, thereby increasing memory capacity and density while reducing gate injection.

Implementation Method 1

A thermal step is performed to diffuse a dopant from the second electrode material into the first electrode material

Methodology Applied
Scientific EffectDiffusion: Diffusion

Data Source

PatentUS9252155B2Memory device and method for manufacturing the same
Publication Date: 2016.02.02 MACRONIX INTERNATIONAL CO LTD
  • US9252155B2 patent drawing
  • US9252155B2 patent drawing
  • US9252155B2 patent drawing

AI summary

A semiconductor structure and a method for manufacturing the same are disclosed. The semiconductor structure includes a first electrode layer, a second electrode layer and a dielectric layer between the first electrode layer and the second electrode layer. A width of the second electrode layer becomes larger in a direction away from the dielectric layer.