Asymmetric EMI Shielding for Uniform Sputter Deposition

Solution Overview

Problem

Conformal sputtering techniques for creating EMI shielding layers in electronic device packages result in slow deposition rates and uneven material distribution, leading to inefficiencies in material usage and throughput due to directional deposition limitations.

Innovation Solution

The electronic device package design features side surfaces oriented at non-perpendicular angles relative to the bottom surface, allowing for more uniform deposition of material across the top and side surfaces, thereby reducing the disparity in deposition rates and optimizing material usage and throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conformal sputtering technique is used to create EMI shielding layer, then EMI shielding is achieved, but deposition rate is slow and material distribution is uneven

Engineering Contradiction:

ImproveEMI shielding effectivenessVSAvoiddeposition rate

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The package design employs asymmetric side surface orientations (non-perpendicular angles) rather than symmetric perpendicular surfaces. This asymmetry in geometric configuration optimizes the deposition pattern during sputtering, allowing material to be deposited more uniformly across surfaces with varying orientations, thereby improving both deposition rate and material distribution uniformity while maintaining EMI shielding effectiveness.

Inventive Principle:

Principle #4Asymmetry

2Reliability

If conformal sputtering technique is used to create EMI shielding layer, then EMI shielding is achieved, but material distribution is uneven across surfaces

Engineering Contradiction:

ImproveEMI shielding effectivenessVSAvoidmaterial distribution uniformity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The package design employs asymmetric side surface orientations (non-perpendicular angles) rather than symmetric perpendicular surfaces. This asymmetry in geometric configuration optimizes the deposition pattern during sputtering, allowing material to be deposited more uniformly across surfaces with varying orientations, thereby improving both deposition rate and material distribution uniformity while maintaining EMI shielding effectiveness.

Inventive Principle:

Principle #4Asymmetry

3Ease of manufacture

If perpendicular side surfaces are used, then manufacturing is simplified, but deposition rate disparity between top and side surfaces increases

Engineering Contradiction:

Improvepackage structure simplicityVSAvoiddeposition rate uniformity

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The package design employs asymmetric side surface orientations (non-perpendicular angles) rather than symmetric perpendicular surfaces. This asymmetry in geometric configuration optimizes the deposition pattern during sputtering, allowing material to be deposited more uniformly across surfaces with varying orientations, thereby improving both deposition rate and material distribution uniformity while maintaining EMI shielding effectiveness.

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the uniformity of the EMI shielding layer thickness, improving the efficiency of the deposition process and reducing material waste, while maintaining effective electromagnetic interference shielding.

Implementation Method 1

One mechanism for creating EMI shielding is with a conformal sputtering technique. In this case, the material of the EMI shield is sputtered or deposited on an exposed outer surface of the electronic device package

Methodology Applied

Scientific EffectSputtering: Sputtering

Data Source

PatentUS10325866B2Electronic device packages with conformal EMI shielding and related methods

Publication Date: 2019.06.18 INTEL CORP

AI summary

Electronic device package technology is disclosed. In one example, an electronic device package can include a bottom surface and a side surface extending from the bottom surface. The side surface can be oriented at a non-perpendicular angle relative to the bottom surface. In another example, an electronic device package can include a top planar surface having a first area, a bottom planar surface having a second area, and a side surface extending between the top surface and the bottom surface. The second area can be larger than the first area. In yet another example, an electronic device package can include a substrate defining a plane, an electronic component disposed on the substrate, and a layer of material disposed about a lateral side of the electronic component. The layer of material can be oriented at an angle of less than 90 degrees relative to the plane.