Asymmetric Lamination for Superconducting Wire Rigidity
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Solution Overview
Problem
Superconducting wire materials face a decrease in current density when metal substrates are laminated on both sides, leading to reduced mechanical strength and difficulties in coil winding, while existing solutions either compromise on current density or mechanical strength.
Innovation Solution
A method involving a laminated structure with a deposition substrate, buffer, superconducting, and stabilization layers, where metal substrates are exposed on both sides and bonded with a solder to a lamination substrate, maintaining current density and providing necessary rigidity without additional thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If metal substrates are laminated on both sides of the superconducting wire material, then mechanical strength and rigidity are improved, but current density decreases due to increased overall thickness
Solution Approach 1:
The patent extracts the lamination structure from both sides of the superconducting wire, retaining only a single lamination substrate on one side. This eliminates the unnecessary thickness contribution from the other side while preserving the mechanical strength provided by the retained lamination, thereby maintaining current density without sacrificing structural integrity.
Solution Approach 2:
The patent introduces asymmetry in the lamination configuration by placing the lamination substrate only on one side of the superconducting wire rather than symmetrically on both sides. This asymmetric arrangement reduces the overall thickness and preserves current density while still providing adequate mechanical support and rigidity through the single lamination layer.
2Stability of the object's composition
If lamination substrates are added to both sides, then rigidity is improved for handling, but coil winding becomes difficult due to excessive mechanical strength
Solution Approach 1:
The patent removes one lamination substrate from the dual-side configuration, extracting the excess rigidity that was causing coil winding difficulties. The remaining single lamination substrate provides sufficient structural stability for handling while reducing the overall mechanical strength to acceptable levels that allow for easier coil winding operations.
Solution Approach 2:
The patent applies partial lamination by placing the lamination substrate on only one side rather than both sides. This partial action provides just enough rigidity for handling and stability during operation, while avoiding the excessive mechanical strength that would make coil winding difficult, thus achieving the optimal balance between stability and ease of operation.
3Strength
If lamination substrates are laminated on both sides, then mechanical strength is improved, but the wire material becomes thicker reducing current density
Solution Approach 1:
The patent extracts one lamination substrate from the both-sides configuration, removing the excessive thickness contribution while retaining the essential mechanical strength support. This results in a thinner overall wire structure that maintains adequate mechanical properties without the thickness penalty of dual-side lamination.
Solution Approach 2:
The patent employs asymmetric lamination placement on only one side of the superconducting wire, which reduces the overall thickness compared to symmetric dual-side lamination. This asymmetric approach provides sufficient mechanical strength while minimizing the increase in wire thickness, thereby preserving current density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method prevents a decrease in current density while offering optimal rigidity to the wire material, allowing for easier handling and winding without the need for additional lamination substrates.
Implementation Method 1
providing a solder to the regions, in which the metal substrate is exposed, to thereby bond the deposition substrate and the lamination substrate
Implementation Method 2
the step of forming the regions in which the metal substrate is exposed is performed by laser ablation
Data Source
AI summary
Disclosed is a method for manufacturing a superconducting wire material having a laminated structure. The present invention provides a method for manufacturing a laminated superconducting wire material, comprising the steps of: providing a deposition substrate having a predetermined width; sequentially forming, on the deposition substrate, a laminated structure including a buffer layer, a superconducting layer and a stabilization layer, thereby forming, on both sides of the deposition substrate, regions in which a metal substrate is exposed in the width direction; providing a lamination substrate, having a width corresponding to the deposition substrate, to the laminated structure; and providing solder to the regions, in which the metal substrate is exposed, to thereby bond the deposition substrate and the lamination substrate.