Asymmetric LED Package Layout for Border-Bonded Tiled Displays
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Solution Overview
Problem
The existing MicroLED display technology faces challenges in manufacturing and mounting due to the need for very small package sizes, which results in poor product stability and high costs, and the border bonding technology occupies display surface space, limiting the available area for tiling.
Innovation Solution
A LED package structure with multiple light-emitting units in one package, featuring an asymmetrical arrangement of solder pads and LED chips, reduces the number of solder pads and provides sufficient space for border bonding, enhancing bonding strength and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the MicroLED package size is reduced to meet border bonding process space requirements, then border bonding can be implemented, but manufacturing and mounting become difficult resulting in poor product stability and high mounting cost
Solution Approach 1:
The patent combines multiple light-emitting units (including RGB chips and common cathode) into a single integrated package structure. This merging approach reduces the number of separate components and solder pads needed, thereby reducing the overall package size to accommodate border bonding requirements while maintaining manufacturability through standardized integration processes
Solution Approach 2:
The package structure integrates multiple functions into a single unit: RGB light-emitting chips, common cathode connections, and bonding interfaces are all incorporated into one package. This multi-functional design reduces the number of separate components required, simplifying the manufacturing process and improving product stability while enabling border bonding implementation
2Adaptability or versatility
If a single pixel package with RGB three colors is used, then complete color display is achieved, but at least four solder pads are required (one common cathode and R, G, B three anodes) increasing the area burden
Solution Approach 1:
The patent merges multiple light-emitting units with different colors (RGB chips) and common cathode structures into a single integrated package. By combining these components and sharing common electrical connections, the design reduces the total number of solder pads from four separate pads to a more compact arrangement, thereby reducing the package area while maintaining full color display capability
Solution Approach 2:
The package structure uses a common cathode that serves multiple light-emitting units simultaneously, creating a multi-functional design where a single cathode structure provides electrical connection for multiple RGB chips. This universal connection approach reduces the number of separate solder pads needed, decreasing the overall package area while preserving complete color display functionality
3Productivity
If border bonding technology is used to form large-size display screen, then tiling capability is achieved, but part of display surface is occupied by bonding regions
Solution Approach 1:
The patent segments the display into multiple tilable panels with standardized package structures. Each package is designed with asymmetric solder pad arrangement optimized for border bonding, allowing panels to be tiled together to form large displays. This segmentation enables tiling capability while minimizing the bonding region footprint through efficient package design
Solution Approach 2:
The package structure employs asymmetric solder pad arrangement where the positions and configurations of solder pads are optimized specifically for border bonding applications. This asymmetric design allows the bonding region to be minimized and efficiently positioned, enabling tiling capability while occupying minimal display surface area
Data Source
AI summary
A LED package structure, a display panel and a tiling-type display device are provided. The LED package structure includes a package base, light-emitting units and an encapsulant layer. The package base is disposed with solder pads for bonding with a subsequent driving substrate. The light-emitting units include LED chips. The LED package structure has a first edge and an opposite second edge. A distance from a center point position of the light-emitting unit closest to the first edge among the light-emitting units to the first edge is not equal to a distance from a center point position of the light-emitting unit closest to the second edge among the light-emitting units to the second edge. By way of the design of the LED package structure, an edge of the package structure is retracted inwardly and the position of solder pad is moved inwards to provide sufficient space for border bonding.