Asymmetric LED Package for Backlight Light Mixing

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Solution Overview

Problem

Conventional LED package structures for backlight modules have a fixed light-mixing distance due to their volume, leading to unfavorable light uniformity and increased size, especially when used with large-sized light guide plates.

Innovation Solution

An LED package structure with a carrier having different included angles between its side walls and bottom surface, allowing for varied spatial radiation patterns that shorten the light-mixing distance while increasing the light-transmitting distance, achieved by arranging LED chips in a straight-line configuration and forming a package body to cover them.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a conventional LED package structure with fixed volume is used, then the structure is simple to manufacture, but the light-mixing distance cannot be shortened and the backlight module volume increases

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidbacklight module volume
Core Design Contradiction:
Ease of manufactureVSVolume of stationary object

Solution Approach 1:

The patent applies asymmetry by designing the package body with non-uniform thickness distribution. The package body has a first thickness in the light-mixing direction and a second thickness in the light-transmitting direction, where the ratio between first and second thicknesses is specifically controlled. This asymmetric design allows the light-mixing distance to be shortened while maintaining adequate light-transmitting distance, thereby reducing overall backlight module volume without compromising manufacturing simplicity

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent changes the geometric parameters of the package body by controlling the thickness ratio between the light-mixing direction and light-transmitting direction. By optimizing this thickness parameter ratio, the invention achieves shorter light-mixing distance while maintaining sufficient light-transmitting distance, thus reducing backlight module volume while keeping the structure manufacturable

Inventive Principle:
Principle #35Parameter changes

2Device complexity

If a square-shaped chamber is used to mix light beams, then the structure is simple, but the light-transmitting distance is insufficient and light uniformity deteriorates

Engineering Contradiction:
Improvechamber structure complexityVSAvoidlight uniformity
Core Design Contradiction:
Device complexityVSIllumination intensity

Solution Approach 1:

The patent replaces the conventional square-shaped chamber with an asymmetric package body design having different thicknesses in different directions. The package body has optimized thickness in the light-mixing direction compared to the light-transmitting direction, creating asymmetric light path lengths that improve light uniformity while maintaining structural simplicity

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent transitions from a two-dimensional square chamber concept to a three-dimensional package body with varying thickness. By introducing thickness variation as an additional dimensional parameter, the invention achieves better light mixing and uniformity distribution without significantly increasing structural complexity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Volume of stationary object

If the pitch among LED package structures is reduced, then the backlight module volume decreases, but the light-mixing distance requirement cannot be met

Engineering Contradiction:
Improvebacklight module volumeVSAvoidlight-mixing distance precision
Core Design Contradiction:
Volume of stationary objectVSManufacturing precision

Solution Approach 1:

The patent changes the internal geometric parameters of the package body, specifically the thickness in the light-mixing direction, to optimize the light-mixing distance. By adjusting this parameter, shorter pitch between LED package structures can be used while still achieving adequate light mixing, thus reducing backlight module volume without compromising light uniformity

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the light-mixing distance by 14 mm compared to conventional structures, enhances light intensity by 30% at a given distance, and ensures better light uniformity across larger display panels.

Implementation Method 1

a plurality of LED chips (320) disposed in a straight-line arrangement on a center line (302) of the bottom surface (318) and electrically connected to the carrier (310)

Methodology Applied
Scientific EffectLight Emitting Diode: Light Emitting Diode

Implementation Method 2

an included angle (alpha) between each of the first side walls (314) and the bottom surface (318) is different from an included angle (beta) between each of the second side walls (316) and the bottom surface (318)

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS7663154B2Backlight module and light emitting diode package structure therefor
Publication Date: 2010.02.16 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • US7663154B2 patent drawing
  • US7663154B2 patent drawing
  • US7663154B2 patent drawing

AI summary

A LED package structure including a carrier, LED chips, and a package body is provided. The carrier defines a cave with two opposite first side walls, two opposite second side walls and a rectangular bottom surface. An included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface. The LED chips are disposed in a straight-line arrangement on a center line of the bottom surface and electrically connected to the carrier. The center line is parallel to a long side of the bottom surface. The package body is formed on the carrier to cover the LED chips. Since the included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface, light provided by the LED package structure has different spatial radiation patterns in different directions.