Asymmetric Double-Sided Manifold Cold Plate for High Heat Flux
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Solution Overview
Problem
Conventional heat sinks are inadequate for managing the increased heat flux generated by high-power electronics, particularly in compact and variable arrangements, necessitating more configurable and efficient cooling solutions.
Innovation Solution
A double-sided manifold cooling assembly with a configurable design, featuring a manifold with openings on one side extending into a recess on the other, fluidly coupled with heat sinks and fluid cores, including a flow distribution insert and plate fins, to distribute and manage cooling fluid effectively across opposing sides, accommodating components of different sizes and heat loads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional heat sinks are used, then the structure is simple, but they are inadequate for managing increased heat flux from high-power electronics
Solution Approach 1:
The cooling assembly is divided into multiple independent fluid cores, each with its own heat sink and plate fin assembly. This segmentation allows each core to be independently configured for different heat loads and component arrangements, enabling the system to adapt to varying power electronic layouts while maintaining effective heat flux management across the entire manifold
Solution Approach 2:
The patent implements adjustable and reconfigurable cooling channels within the manifold that can be dynamically adjusted to match different component arrangements. The fluid distribution system allows for variable flow rates to different regions, enabling the cooling assembly to adapt to changing thermal requirements of power electronic components
2Power
If power electronics operate at increased power levels, then higher heat flux is generated, but conventional heat sinks cannot reject sufficient heat
Solution Approach 1:
The patent utilizes a liquid coolant flowing through the manifold and fluid cores to efficiently remove high heat flux from power electronics. The hydraulic system is designed with optimized flow channels and distribution mechanisms that ensure adequate coolant flow even at high power levels, maintaining operating temperatures through enhanced convective heat transfer
Solution Approach 2:
The cooling assembly employs composite construction with the manifold and fluid cores made from materials optimized for thermal conductivity and heat transfer. The combination of high-conductivity materials in the heat transfer paths with structurally sound materials in the housing creates a composite system capable of handling high heat flux while maintaining effective cooling
3Volume of moving object
If power electronics modules are incorporated into compact arrangements, then space is reduced, but cooling assembly configurability is needed
Solution Approach 1:
The cooling assembly features nested construction where fluid cores are positioned within the manifold structure, and heat sinks are integrated with the plate fin assemblies. This nesting allows the cooling components to be compactly arranged while maintaining the configurability needed for different power electronic module layouts, effectively reducing overall volume without sacrificing adaptability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat management for both large and small electronic components by distributing cooling fluid uniformly across modular heat sinks, maintaining optimal operating temperatures in high-power electronic systems while allowing for compact and flexible system design.
Implementation Method 1
The cooling fluid may be introduced to the heat management device, where it receives heat from the heat management device, primarily through convective and/or conductive heat transfer
Implementation Method 2
The cooling fluid may be introduced to the heat management device, where it receives heat from the heat management device, primarily through convective and/or conductive heat transfer
Implementation Method 3
the flow distribution insert is configured to receive a fluid, divert the received fluid into the first and second plate fins, and receive a return of the fluid from the first and second plate fins
Data Source
AI summary
A cold plate having a manifold includes a recess extending from a first side to a second side of the manifold, where the recess includes openings to the recess positioned lengthwise along the first side and a single opening to the recess on the second side, an inlet and an outlet fluidly coupled to the recess, a plurality of plates fastened to the first side enclosing the openings, a heat sink fastened to the second side enclosing the single opening on the second side, and a plurality of fluid cores one of each positioned between each of the plurality of plates and the heat sink. The plurality of fluid cores include a flow distribution insert, a first plate fin positioned between the flow distribution insert and the heat sink fastened to the second side, and a second plate fin positioned between the flow distribution insert and the heat sink.