Asymmetric Component Mounting Substrate for Universal Electrical Testing
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Solution Overview
Problem
Existing substrates for measuring electrical characteristics of electronic components require separate substrates for components with symmetric and asymmetric terminals, leading to increased production costs and inventory complexity.
Innovation Solution
A substrate with laminated dielectric layers, asymmetric front-surface and back-surface component mounting electrodes, and interlayer ground electrodes, allowing for the measurement of two electronic components with asymmetric terminals as mirror images using a single substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate substrates are prepared for symmetric and asymmetric electronic components, then measurement capability for different component types is improved, but production cost and inventory complexity increase
Solution Approach 1:
The substrate is designed with component mounting electrodes on both the front surface and back surface, allowing a single substrate to measure both symmetric and asymmetric electronic components. The front-surface component mounting electrode and back-surface component mounting electrode can be used independently or in combination, making the substrate universal for different component types without requiring separate specialized substrates.
2Adaptability or versatility
If separate substrates are prepared for symmetric and asymmetric electronic components, then measurement capability for different component types is improved, but production cost increases
Solution Approach 1:
The substrate merges the functionality of multiple specialized substrates into a single device. By integrating front-surface component mounting electrodes and back-surface component mounting electrodes on the same substrate, the invention combines the capabilities of separate symmetric and asymmetric measurement substrates, reducing production costs through economies of scale and simplified manufacturing processes.
3Device complexity
If a single substrate is used for both symmetric and asymmetric components, then production cost and inventory complexity are reduced, but measurement precision for asymmetric components may be compromised
Solution Approach 1:
The substrate implements local quality by providing specialized electrode configurations in different locations. The front-surface component mounting electrode is optimized for certain component types while the back-surface component mounting electrode is optimized for other types. Each region of the substrate has tailored characteristics that ensure measurement precision for the specific component type mounted on that surface.
Data Source
AI summary
An electrical characteristic measuring substrate includes a plurality of laminated dielectric layers, front-surface coplanar lines disposed at a front surface of the substrate, back-surface coplanar electrodes disposed at a back surface thereof, and interlayer ground electrodes disposed between dielectric layers. First ends of the front-surface coplanar lines define a front-surface component mounting electrode, and first ends of the back-surface coplanar lines define a back-surface component mounting electrode. The front-surface component mounting electrode and the back-surface component mounting electrode have substantially the same pattern when viewed from the direction perpendicular to the front surface. Each of the front-surface component mounting electrode and the back-surface component mounting electrode has an electrode pattern asymmetric about a substantially central line of the front surface or about that of the back surface.