Asymmetric Nozzle Head Layout for Uniform ALD Pore Coating
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Solution Overview
Problem
In spatial atomic layer deposition (ALD), achieving uniform coating in substrate pores and pinholes is compromised due to excessive precursor and purge gas usage, leading to waste and reduced concentration, which slows down diffusion and compromises coating uniformity.
Innovation Solution
A nozzle head design with asymmetric gas zones, where the second zone end nozzle is positioned at least 1.5 times further from the gas supply nozzle, allowing extended residence time and counter flow to ensure precursors and purge gases reach the bottom of pores and pinholes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If great amounts of precursor and purge gas are supplied to ensure uniform coating in pores and pinholes, then coating uniformity is improved, but material efficiency deteriorates due to precursor waste
Solution Approach 1:
The nozzle head is segmented into multiple nozzles arranged in a specific pattern, with at least one precursor nozzle and at least one purge nozzle. This segmentation allows precise control of gas flow paths, directing precursors to the substrate surface while using separate purge nozzles to remove excess precursors, thereby reducing waste while maintaining coating uniformity in pores and pinholes
Solution Approach 2:
The purge gas acts as an intermediary substance that mediates between the precursor supply and the substrate. By introducing purge gas through dedicated purge nozzles positioned strategically, excess precursors are removed from the reaction zone, preventing waste accumulation while ensuring complete precursor penetration into substrate features for uniform coating
2Manufacturing precision
If great amounts of precursor and purge gas are supplied to reach the bottom of pores and pinholes, then coating completeness is improved, but reaction space volume increases reducing gas concentration
Solution Approach 1:
The nozzle head design implements local quality by positioning specific nozzles at different locations and orientations. Precursor nozzles are positioned to deliver high concentration precursor gas directly to areas needing coating, while purge nozzles are positioned to remove excess gas from specific zones. This localized control maintains high gas concentration where needed while ensuring complete penetration into pores and pinholes
Solution Approach 2:
The invention transitions from a single-direction gas flow approach to a multi-dimensional gas distribution system. By arranging nozzles in specific spatial patterns with different orientations, the system creates complex three-dimensional gas flow paths that enhance precursor penetration depth into substrate features while maintaining adequate gas concentration through optimized flow geometry
3Quantity of substance
If reaction space volume is increased to accommodate greater gas amounts, then gas supply capacity is improved, but diffusion speed deteriorates preventing precursor reach to pore bottoms
Solution Approach 1:
The invention employs pneumatic principles by using pressurized gas flow through specifically designed nozzle channels. The nozzle geometry and arrangement create controlled gas flow dynamics that enhance diffusion speed through the substrate pores. By optimizing the pneumatic delivery system, sufficient precursor gas reaches the bottom of pores and pinholes rapidly, maintaining both supply capacity and diffusion speed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances gas concentration and exposure time, enabling uniform coating by ensuring precursors and purge gases effectively penetrate deep into substrate features, reducing waste and improving material efficiency.
Implementation Method 1
a gas supply nozzle arranged to supply gas towards the surface of the substrate
Implementation Method 2
a discharge nozzle arranged to discharge gas from the surface of the substrate
Implementation Method 3
diffusion of the precursor or the purge gas into the pores or pinholes will slow down preventing the precursors or the purge gas to reach the bottom of the pores or pinholes
Data Source
AI summary
A nozzle head and apparatus for subjecting a surface of a substrate to alternate surface reactions of at least two precursors (A, B) includes an output face, at least one gas supply nozzle, and at least one discharge nozzle. The nozzle head includes on the output face in the following order: a first zone end nozzle, a gas supply nozzle and a second zone end nozzle, repeated one or more times. The first zone end nozzle is arranged at a first distance (LY) from the gas supply nozzle and the second zone end nozzle is arranged at a second distance (LX) from the gas supply nozzle. The second distance (LX) is greater than the first distance (LY).


