Asymmetric Passive Component Dummy Portion for Thin Film Durability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in manufacturing and packaging ultra-thin passive components, such as capacitors, due to susceptibility to cracking and chipping, as well as issues during transportation and assembly, particularly with components thinner than 65 microns.
Innovation Solution
A passive component with an asymmetric structure is introduced, featuring a dummy portion that protects the capacitive, resistive, or inductive device portion, allowing for post-assembly grinding to reduce thickness while minimizing damage, thereby enhancing durability and ease of handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If ultra-thin passive components (thinner than 65 microns) are manufactured to reduce footprint, then device size is reduced, but susceptibility to cracking and chipping increases
Solution Approach 1:
The passive component is divided into a device portion and a dummy portion. The dummy portion acts as a sacrificial element that can be selectively removed after assembly, allowing the device portion to be thinner without compromising overall structural integrity during manufacturing and handling.
Solution Approach 2:
The dummy portion is formed as part of the component structure before assembly, providing preliminary protection and structural support. After assembly, the dummy portion is selectively removed through grinding or other removal processes to achieve the final low-profile configuration.
2Volume of moving object
If component thickness is reduced to achieve low-profile design, then footprint is minimized, but manufacturing and transportation handling becomes difficult
Solution Approach 1:
By segmenting the component into device and dummy portions, the structure provides enhanced handling characteristics during manufacturing and transportation. The dummy portion adds robustness without increasing the final profile, as it can be removed after assembly.
Solution Approach 2:
The dummy portion is positioned specifically to provide structural support and protection where needed during manufacturing and handling. This localized addition of material improves ease of manufacture without increasing the overall footprint of the functional device portion.
3Reliability
If asymmetric structure with dummy portion is introduced to protect device portion, then component integrity is improved, but device complexity increases
Solution Approach 1:
The component employs an asymmetric structure with a dummy portion that is selectively removed. This asymmetric design provides protection and structural support during manufacturing while enabling simple removal processes. The asymmetry is resolved after assembly when the dummy portion is ground away, leaving a simple low-profile device portion.
Data Source
AI summary
A passive component includes a body including a dummy portion and a device portion. The dummy portion and the device portion extend in a first direction and are arranged such that a longitudinal axis of the device portion is offset from a longitudinal axis of the body in a second direction perpendicular to the first direction. The passive component further includes first and second electrical contacts on at least one surface of the body.