Asymmetric PCB Assembly for Vehicle-Motor Logic and Power Integration

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Solution Overview

Problem

Traditional multi-circuit board configurations for vehicle-motor interfaces are limited by size due to the need for separate single-sided circuit boards for logic and power components, which restricts packaging options without compromising functionality.

Innovation Solution

A single circuit board assembly with non-symmetric layers, where one side has fewer layers for logic modules and another side with more layers for power modules, allowing for a non-symmetric conduction assembly that uses sintering and lead-free conductive paste for efficient component placement and heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a multi-circuit board configuration is used to separate logic and power components, then functionality is maintained, but the overall size and packaging space increase

Engineering Contradiction:

ImprovefunctionalityVSAvoidpackaging space

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent combines logic components and power components onto a single circuit board, merging two previously separate functions into one integrated assembly. This reduces the overall packaging space while maintaining the functional separation through asymmetric layer design, directly resolving the contradiction between functionality and size.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes the Z-dimension (thickness) by implementing asymmetric layer distributions on opposite sides of the board. One side has fewer layers for logic components while the other side has more layers for power components, allowing functional separation in the vertical dimension rather than requiring separate horizontal boards.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If separate single-sided circuit boards are used for logic and power components, then component placement is simplified, but device complexity and number of conduction intermediaries increase

Engineering Contradiction:

Improvecomponent placementVSAvoidnumber of conduction intermediaries

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

By merging logic and power components onto a single board with asymmetric layering, the patent eliminates the need for multiple conduction intermediaries that would be required to connect separate single-sided boards, reducing device complexity while maintaining manufacturing simplicity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The asymmetric layer distribution across the board thickness allows direct vertical connections between logic and power components through controlled impedance structures, eliminating the need for external conduction intermediaries and reducing overall system complexity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If a symmetric multi-layer board is used, then manufacturing is simplified, but heat management and electrical performance for power components are compromised

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidheat management

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent implements asymmetric layer distribution where one side of the board has fewer layers optimized for logic components while the other side has more layers dedicated to power components. This asymmetric design provides enhanced heat sinking capability and electrical performance for power components without significantly complicating the manufacturing process.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

Different regions of the board are optimized for different functions: the logic side uses fewer layers for signal integrity while the power side uses more layers for heat dissipation and current carrying capacity, allowing each region to have the specific qualities needed for its function.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables compact integration of high-powered and logic components on a single board, optimizing packaging space while maintaining functionality and allowing for effective cooling and electrical connectivity.

Implementation Method 1

uses sintering and lead-free conductive paste for efficient component placement and heat management

Methodology Applied

Scientific EffectSintering: Sintering

Implementation Method 2

the heat sink assembly defines a pocket on a single side of the heat sink assembly

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20230389177A1Non-symmetric single circuit board assembly with logic and power components

Publication Date: 2023.11.30 STEERING SOLUTIONS IP HOLDING CORP

AI summary

A single circuit board assembly for forming a vehicle-motor interface includes a first side of a board with logic modules located thereon. The single circuit board assembly also includes a second side of the board with power modules located thereon. The board comprises a first plurality of layers and a second plurality of layers, the first plurality of layers adjacent the first side of the board and the second plurality of layers adjacent the second side of the board, wherein the first plurality of layers has a first total thickness and the second plurality of layers has a second total thickness, wherein the first total thickness is different than the second total thickness.