Asymmetric Process Module Layout for Wafer Transfer Efficiency

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Solution Overview

Problem

Existing substrate processing systems face challenges in reducing the footprint of process modules that handle four wafers simultaneously, leading to increased space requirements and the need for customized wafer transfer mechanisms for different module sizes.

Innovation Solution

A process module with a two-row and two-column layout, where the row and column intervals have different dimensions, combined with a rotation arm and deviation detection sensors, allows for efficient wafer transfer and sharing of transfer mechanisms, reducing the footprint and improving space efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If four wafers are processed simultaneously in one chamber with a conventional symmetric layout, then processing capacity is improved, but the footprint area increases and requires customized transfer mechanisms for different module sizes

Engineering Contradiction:

Improvewafer processing capacityVSAvoidprocess module footprint

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

The patent applies asymmetry by configuring the four stages in an asymmetric two-row and two-column layout where the row interval and column interval have different dimensions. This asymmetric arrangement reduces the overall footprint area compared to conventional symmetric layouts while maintaining the capability to process four wafers simultaneously, thus resolving the contradiction between productivity and footprint area.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent implements universality by designing a standardized wafer transfer mechanism that can accommodate multiple process modules with different footprints. The transfer mechanism is configured to handle the asymmetric stage arrangements universally, allowing one transfer mechanism design to serve multiple module sizes and configurations, thereby reducing the need for customized mechanisms for each module size.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If different sized process modules are used to match various processing needs, then adaptability is improved, but the complexity of wafer transfer mechanisms increases

Engineering Contradiction:

Improveprocess module size compatibilityVSAvoidwafer transfer mechanism complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies universality by creating a standardized wafer transfer mechanism design that can interface with multiple process modules of different sizes and configurations. The transfer mechanism incorporates standardized features that allow it to work with the asymmetric two-row and two-column stage layouts universally, reducing the need for custom-designed transfer mechanisms for each module size and thereby reducing device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent applies segmentation by separating the process module design from the transfer mechanism design. The process modules are segmented into standardized configurations with asymmetric stage layouts, while the transfer mechanism is designed as a separate, universal component that can adapt to these segmented module configurations without requiring customization for each specific module size.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20220213594A1Process module, substrate processing system, and processing method

Publication Date: 2022.07.07 TOKYO ELECTRON LTD

AI summary

A process module includes four stages arranged in a two-row and two-column layout inside the process module, wherein a row interval and a column interval that constitute the two-row and two-column layout have different dimensions.