Asymmetric Relay Substrate for Semiconductor Device Processing
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Solution Overview
Problem
The existing semiconductor devices with protruding conductors on both surfaces of the printed circuit board face challenges in router processing and V-cutting, leading to impaired workability and accuracy, as well as reduced design flexibility.
Innovation Solution
A semiconductor device design featuring a relay substrate with a through hole connecting lower and upper conductors, where only the lower conductor protrudes outward, allowing for easier processing and improved flexibility in design and manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductor parts protrude from both sides of the printed circuit board, then electrical connection is achieved, but workability in router processing and V-cutting is significantly impaired
Solution Approach 1:
The patent applies asymmetry by making the conductor configuration asymmetric: one conductor protrudes from the first surface while the other conductor is positioned inside the insulating plate and does not protrude. This asymmetric design resolves the technical contradiction by enabling one-sided electrical connection (maintaining reliability) while eliminating protrusions from both sides (improving router processing and V-cutting workability).
Solution Approach 2:
The patent extracts the protruding conductor from one side of the insulating plate, leaving only one conductor to protrude while positioning the other conductor inside the plate. This extraction of the unnecessary protrusion resolves the contradiction by maintaining electrical connection functionality while eliminating the workability issues caused by dual-side protrusions.
2Reliability
If conductor parts protrude from both sides of the printed circuit board, then electrical connection is achieved, but design flexibility deteriorates
Solution Approach 1:
The asymmetric conductor configuration allows different design arrangements where one conductor can be externally accessible while the other remains internal, providing greater design flexibility for various applications while maintaining reliable electrical connection.
Solution Approach 2:
The patent applies local quality by differentiating the positions of the two conductors: one is positioned to protrude for external connection while the other is positioned inside the insulating plate. This localized differentiation enables tailored design solutions for specific application requirements, improving overall design flexibility.
3Reliability
If both lower and upper conductors protrude outward, then electrical connection is established, but processing accuracy is impaired
Solution Approach 1:
The patent extracts the protrusion feature from one of the conductors, leaving it positioned inside the insulating plate rather than protruding outward. This eliminates the processing accuracy issues associated with dual-side protrusions while maintaining the electrical connection function through the remaining protruding conductor.
Data Source
AI summary
A semiconductor device according to the present invention includes a relay substrate provided on a plurality of semiconductor chips. The relay substrate includes an insulating plate in which a through hole is formed, a lower conductor provided on a lower surface of the insulating plate and having a first lower conductor and a second lower conductor, an upper conductor provided on an upper surface of the insulating plate, a connection part provided in the through hole and connecting the second lower conductor and the upper conductor together, and a protruding part which is a part of one of the first lower conductor and the upper conductor and protrudes outward from the insulating plate, the protruding part is connected to a first external electrode, and another of the first lower conductor and the upper conductor is connected to a second external electrode and is positioned inside the insulating plate.