Asymmetric Spacer Design for Semiconductor Module Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing semiconductor modules face challenges in improving heat dissipation performance while maintaining a limited spacer size to avoid interference with signal lines and electrical insulation from guard rings.
Innovation Solution
A semiconductor module design where the spacer's connection area with the heat dissipation portion is larger than its connection area with the semiconductor element, allowing for enhanced heat dissipation without interfering with signal lines and ensuring electrical insulation from guard rings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the connection area of the spacer where the spacer and the semiconductor element are connected is increased, then the heat dissipation performance of the semiconductor element is improved, but the spacer interferes with the signal line and the connecting portion (pad portion) of the semiconductor element
Solution Approach 1:
The spacer is designed with different connection areas at different locations: a first connection area at the first end (contacting heat dissipation plate) and a second connection area at the second end (contacting semiconductor element). The first connection area is larger than the second connection area, allowing optimized heat dissipation at the heat dissipation interface while maintaining adequate signal line connection space at the semiconductor element interface
2Temperature
If the spacer size is increased to improve heat dissipation, then the heat dissipation performance is improved, but the spacer interferes with the guard ring and electrical insulation cannot be ensured
Solution Approach 1:
The spacer has asymmetric connection areas where the first connection area (at heat dissipation plate) is larger than the second connection area (at semiconductor element). This local differentiation allows the spacer to achieve adequate heat dissipation through the larger first connection area while the smaller second connection area maintains proper clearance from the guard ring, ensuring electrical insulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation performance while maintaining a compact spacer size, allowing for easier connection of signal lines and preventing electrical interference, thus optimizing thermal management in semiconductor modules.
Implementation Method 1
heat of the semiconductor element is dissipated from the heat dissipation portion via the spacer
Data Source
AI summary
A semiconductor module includes a semiconductor element, a first heat dissipation portion, and a spacer. A connection area of the spacer where the spacer contacts the first heat dissipation portion is larger than a connection area of the spacer where the spacer contacts the semiconductor element. Heat of the semiconductor element is dissipated from the first heat dissipation portion via the spacer.