Electronic Device Substrate With Asymmetric Through Holes
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Solution Overview
Problem
Electronic devices face warping issues due to stress and reliability concerns, particularly in the trend towards lightness and thinness, where existing technologies fail to effectively mitigate these problems.
Innovation Solution
The electronic device design includes a substrate with a through hole having a wider peripheral area through hole to increase copper ratio, a buffer layer covering the substrate surfaces and through hole walls, and differing warping tendencies between circuit structures to manage stress and prevent warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the electronic device is made lighter and thinner, then the device meets the trend of lightness and thinness, but warping problems and reliability issues occur
Solution Approach 1:
The patent applies local quality by creating non-uniform through-hole widths at different locations. The peripheral through-holes have greater widths than the central through-hole, providing localized reinforcement at the edges where warping stress is highest, while maintaining overall device thinness and lightness in the central area.
Solution Approach 2:
The patent uses composite material structure by filling through-holes with conductive material (such as copper) within the substrate. This creates a composite structure combining the substrate material with the conductive filler, providing both mechanical reinforcement to prevent warping and electrical connectivity, thus improving reliability without significantly increasing weight.
2Ease of manufacture
If uniform through-holes are used across the substrate, then the manufacturing process is simple, but warping stress is not effectively mitigated
Solution Approach 1:
The patent implements local quality by varying the through-hole widths based on location. Peripheral through-holes have greater widths to provide enhanced stress relief at the edges, while the central through-hole has a smaller width. This non-uniform design effectively mitigates warping stress without requiring completely complex manufacturing processes.
3Temperature
If larger through-holes are used to increase copper ratio, then heat dissipation and signal transmission improve, but substrate strength is reduced
Solution Approach 1:
The patent applies local quality by strategically placing larger through-holes only in the peripheral areas where heat accumulation and signal transmission needs are highest, while keeping the central through-hole smaller to maintain substrate structural integrity. This localized approach optimizes heat dissipation and electrical performance without compromising overall substrate strength.
Solution Approach 2:
The patent uses asymmetry by creating an asymmetric distribution of through-hole sizes across the substrate. The peripheral through-holes are asymmetrically larger than the central through-hole, providing enhanced performance at the edges where it is most needed, while preserving substrate strength in the central region.
Data Source
AI summary
An electronic device having a central area and a peripheral area surrounding the central area is provided. The electronic device includes a substrate, a through hole, a buffer layer, a first circuit structure, an electronic component and a first pad. The substrate has a first surface and a second surface opposite to the first surface. The through hole penetrates through the substrate and has a first through hole and a second through hole. The buffer layer covers the first surface, the second surface, an inner wall of the first through hole and an inner wall of the second through hole. The first circuit structure is disposed on the first surface. The first through hole corresponds to the central area, the second through hole corresponds to the peripheral area, and a width of the second through hole is greater than a width of the first through hole.