Asymmetric Wiring Pad for DRAM Power Penetration
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Solution Overview
Problem
The increasing storage capacity requirements for semiconductor devices, such as DRAM, are hindered by the limited space for wirings between penetration electrodes due to the larger area needed for power penetration electrodes, which restricts the number of wirings that can be arranged in multi-level wiring structures.
Innovation Solution
The semiconductor device incorporates elongated wiring pads with a rectangular shape, where the width in one direction is greater than the width in a perpendicular direction, allowing for a sufficient wiring area without expanding the chip area significantly, and optimizing the arrangement of signal and power penetration electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power penetration electrodes are provided with larger wiring pads to supply power voltage stably, then power supply stability is improved, but the number of wirings that can be arranged between the pads is reduced
Solution Approach 1:
The wiring pad for the power penetration electrode is configured with an asymmetric rectangular shape having a long side and a short side. The long side extends in a first direction while the short side extends in a second direction perpendicular to the first direction. This asymmetric configuration allows the wiring pad to occupy less area in the second direction, thereby increasing the available space for arranging wirings between adjacent pads while still maintaining sufficient area for stable power supply through the longer dimension.
2Power
If the area of wiring pads for power penetration electrodes is increased, then power supply capability is improved, but the chip area is expanded
Solution Approach 1:
The wiring pad is designed with an asymmetric rectangular shape where the long side extends in the first direction and the short side extends in the second direction. This allows the pad to achieve sufficient area for power supply capability along the long side while minimizing the area occupation in the second direction, thereby preventing significant expansion of the overall chip area.
Solution Approach 2:
Instead of increasing the wiring pad area uniformly in all directions, the design extends the pad area primarily in the first direction (creating a elongated rectangular shape) while keeping the dimension in the second direction relatively small. This directional area expansion allows achieving power supply capability without proportionally increasing the overall chip area.
3Reliability
If wiring pads are arranged in a multi-level wiring structure with penetration electrodes, then electrical connection is improved, but the space for wirings is limited
Solution Approach 1:
The wiring pad is configured with an asymmetric rectangular shape having a long side in the first direction and a short side in the second direction. This asymmetric design optimizes the balance between maintaining electrical connection area and preserving wiring space, as the elongated shape in one direction provides sufficient pad area for reliable electrical connection while minimizing the footprint in the perpendicular direction where wirings need to be routed.
Data Source
AI summary
Disclosed herein is a device that includes a first wiring provided as a first-level wiring layer and elongated in a first direction; and a first wiring pad provided as the first-level wiring layer, the first wiring pad being rectangular and including a first side edge that is elongated in the first direction and a second side edge that is elongated in a second direction crossing to the first direction, the first side edge being greater in length than the second side edge, the first wiring pad being greater in length in the second direction than the first wiring.