Asymmetrical Wiring Layers for Warpage Reduction in Embedded Substrates
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Solution Overview
Problem
Conventional electronic component embedded substrates face challenges in minimizing unnecessary wiring and reducing warpage, especially as substrates become thinner and more integrated, due to differences in thermal expansion coefficients between embedded components and substrate materials.
Innovation Solution
The electronic component embedded substrate design features asymmetrical wiring layers with a higher wiring density and lower thermal expansion materials on one surface and lower wiring density and higher thermal expansion materials on the opposite surface, along with a core substrate and through vias to connect the layers, minimizing warpage and optimizing material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If symmetrical wiring layers are used on both surfaces of the substrate, then warpage is reduced, but unnecessary wiring increases and manufacturing efficiency decreases
Solution Approach 1:
The patent applies asymmetry by configuring different wiring layer structures on the first and second surfaces of the substrate. The first surface has a first wiring layer with specific properties, while the second surface has a second wiring layer with different properties, allowing asymmetric optimization for functionality while maintaining warpage control through balanced overall structure design.
Solution Approach 2:
The patent implements local quality by tailoring the wiring layer properties specifically to the functional requirements of each surface. The first wiring layer is optimized for connections requiring certain electrical characteristics, while the second wiring layer is optimized for different connection requirements, eliminating unnecessary wiring on each surface while maintaining overall structural balance.
2Adaptability or versatility
If electronic component is positioned off-center in the substrate, then integration is improved, but warpage is intensified due to differential thermal expansion
Solution Approach 1:
The patent applies local quality by positioning the electronic component at an off-center location optimized for integration purposes, while locally adjusting the wiring layer properties and thermal expansion characteristics in different regions of the substrate to compensate for the asymmetric positioning and minimize warpage effects.
3Reliability
If wiring density is increased to improve signal transmission, then manufacturing complexity increases and material waste increases
Solution Approach 1:
The patent implements local quality by optimizing wiring density locally on each surface based on specific signal transmission requirements. High-density wiring is applied only where necessary for signal integrity, while low-density or optimized wiring patterns are used in other areas, reducing overall manufacturing complexity and material usage while maintaining reliable signal transmission where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces warpage and minimizes unnecessary wiring, improving process efficiency and reliability while maintaining high conductivity, thus enhancing the integration and performance of electronic components in thinner substrates.
Implementation Method 1
the first insulating portion is made of a material having a lower coefficient of thermal expansion than the second insulating portion
Data Source
AI summary
The present invention can reduce warpage while minimizing unnecessary wiring of an electronic component embedded substrate by including an electronic component; a first wiring layer; and a second wiring layer, wherein at least one of the number of layers and wiring density of the first wiring layer is greater than at least one of the number of layers and wiring density of the second wiring layer and a first insulating portion is made of a material having a lower coefficient of thermal expansion than a second insulating portion.