Asynchronous Tower Rolling Mill for Ultra-Thin Composite Bonding

The patent replaces complex deposition methods (spray deposition, magnetron sputtering) with a mechanical rolling method. The rolling mill uses rollers to directly form the ultra-thin composite strip through mechanical deformation, eliminating the need for complex vapor deposition equipment and processes while achieving the desired material properties.

The patent changes the fundamental processing parameter from deposition (adding material layer by layer) to rolling (mechanical deformation and thinning). This parameter change simplifies the production process while maintaining the ability to produce ultra-thin composite strips with excellent material properties.

The patent introduces patterned rollers with specific surface patterns that apply localized deformation to the material during rolling. This creates controlled local quality changes in the material structure, preventing uniform work hardening and anisotropy while maintaining production efficiency. The patterns help distribute stress evenly and prevent interface cracking.

The patent uses an asynchronous rolling mechanism where the driving rollers can rotate at different speeds dynamically adjusted during the rolling process. This dynamic control allows for coordinated deformation of different material layers, preventing interface cracking while maintaining high production efficiency. The asynchronous operation enables real-time adjustment to prevent stress concentration at interfaces.

The patent incorporates a microstructure rolling step before the final compounding process. This preliminary action prepares the material surfaces by creating micro-patterns and improving surface quality, which enhances subsequent bonding. This preliminary preparation ensures high bonding strength while maintaining the overall simplicity of the rolling process.

The patent merges the microstructure rolling function and compounding function into a single integrated rolling mill system. By combining these functions in one device with coordinated rollers, the process remains simple and easy to manufacture while achieving high bonding strength through the combined effects of microstructure formation and controlled compounding.