AT-Cut Crystal Resonator Plate Layout for Vibration Isolation
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Solution Overview
Problem
Crystal resonator plates with AT-cut crystal structures face issues with vibration leakage and lead-out wiring disconnection due to stepped parts formed during etching, which affect vibration characteristics and bonding strength.
Innovation Solution
The AT-cut crystal resonator plate design features a support part protruding from the vibrating part in the Z' axis direction, with a boundary parallel to the X axis, and lead-out wiring formed to overlap with a gently stepped part, preventing disconnection and improving rigidity by maintaining a bonding area with the external frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the support part is made to protrude from the vibrating part in the Z' axis direction to reduce vibration leakage, then vibration characteristics are improved, but the stepped part formed during etching causes lead-out wiring disconnection
Solution Approach 1:
The patent applies local quality by creating different surface characteristics in different regions of the support part. Specifically, a gentle stepped part is formed at a predetermined position on the support part where the lead-out wiring passes, while other regions maintain the standard stepped structure. This localized modification allows the lead-out wiring to be deposited on a gentler surface that reduces disconnection risk, while preserving the vibration isolation function in other areas.
Solution Approach 2:
The patent applies preliminary action by pre-forming the gentle stepped part on the support part before depositing the lead-out wiring. This preliminary surface preparation ensures that when the wiring is subsequently deposited, it lands on a optimized surface geometry that prevents disconnection, rather than attempting to correct wiring issues after deposition.
2Adaptability or versatility
If the package size is reduced to meet miniaturization requirements, then adaptability to modern electronics is improved, but vibration leakage to the external frame increases
Solution Approach 1:
The patent applies segmentation by dividing the support part into functionally distinct regions: a first region that provides rigid support for structural stability, and a second region with a gentle stepped part that specifically addresses wiring attachment. This segmentation allows each region to be optimized for its specific function while working together to solve both the miniaturization and vibration leakage challenges.
Solution Approach 2:
The patent applies parameter changes by modifying the surface geometry parameters of the support part. The gentle stepped part has different angular and height parameters compared to the standard stepped structure, creating an optimized surface profile that reduces wiring disconnection while maintaining the overall compact structure needed for miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces vibration leakage and disconnection of lead-out wiring, enhancing the stability and impact resistance of the crystal resonator device while maintaining bonding strength and sealing characteristics.
Implementation Method 1
a vibrating part on which excitation electrodes are formed... when the crystal resonator plate is piezoelectrically vibrated
Data Source
Figure 1
Figure 2
Figure 3
AI summary
In a crystal resonator plate (2), a support part (24) extends from only one corner part positioned in the +X direction and in the -Z' direction of a vibrating part (22) to an external frame part (23) in the -Z' direction. The vibrating part (22) and at least part of the support part (24) form an etching region (Eg) having a thickness thinner than a thickness of the external frame part (23). A stepped part is formed at a boundary of the etching region (Eg), and a first lead-out wiring (223) is formed over the support part (24) to the external frame part (23) so as to overlap with the stepped part. At least part of the stepped part that is superimposed on the first lead-out wiring (223) is formed so as not to be parallel to the X axis in plan view.