ATE Interface Board Thermal Overload Detection

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Solution Overview

Problem

Automatic test equipment (ATE) systems face latency in reacting to elevated temperatures in devices under test (DUTs), which can lead to damage, as there is a delay in capturing and processing temperature data for thermal overload detection and recovery.

Innovation Solution

An interface board communicatively coupled with ATE and DUTs, equipped with a temperature monitor and optional temperature activated switch, compares temperature signals to predetermined values, generating an alert signal to shut off power supplies or activate an emergency off module when temperatures exceed thresholds, providing real-time thermal overload detection and recovery.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the ATE system captures and processes temperature data to detect thermal overload, then temperature monitoring capability is improved, but response time increases due to data transmission and calculation latency

Engineering Contradiction:
Improvetemperature monitoring capabilityVSAvoidresponse time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent implements preliminary thermal overload detection by placing temperature sensors and detection circuitry directly on the interface board, allowing the system to detect temperature conditions before damage occurs. The temperature monitor continuously compares sensor readings against threshold values and can immediately trigger protective actions without waiting for data to be transmitted to and processed by the central ATE system, thus resolving the contradiction between monitoring capability and response time.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If the ATE system implements comprehensive temperature monitoring and shutdown protocols, then protection against thermal damage is improved, but system complexity increases

Engineering Contradiction:
Improveprotection against thermal damageVSAvoidsystem complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The interface board performs self-service thermal protection by incorporating temperature sensors, a temperature monitor, and shutdown control circuitry directly into the board. When the temperature monitor detects that a temperature threshold has been exceeded, it automatically generates a shutdown signal to the power supply without requiring intervention from the central ATE system. This self-contained approach provides comprehensive thermal protection while minimizing system complexity by eliminating the need for complex centralized monitoring and control protocols.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables immediate power shutdown during high temperature conditions, protecting ATE, interface boards, DUTs, and associated systems from damage, while providing autonomous real-time temperature feedback and protection.

Implementation Method 1

receive a sensor temperature signal from a temperature sensor located on a DUT or the interface board

Methodology Applied
Scientific EffectThermal energy conversion: Seebeck Effect

Implementation Method 2

The temperature activated switch is adapted to drive the alert signal to the asserted state when a temperature proximate the temperature activated switch raises above a threshold temperature of the temperature activated switch

Methodology Applied
Scientific EffectTemperature-activated switching: Thermal Expansion

Data Source

PatentUS9638718B2ATE thermal overload detection and recovery techniques
Publication Date: 2017.05.02 ADVANTEST CORP
  • US9638718B2 patent drawing
  • US9638718B2 patent drawing
  • US9638718B2 patent drawing

AI summary

A system including an automated test equipment (ATE) and an interface board. The interface board includes a temperature monitor that compares a sensor temperature to a predetermined temperature. The associated temperature sensor may be located near one or more selected components on the device under test or the interface board. If the sensor temperature exceeds the predetermined temperature the temperature monitor turns off one or more power supplies of the ATE.