ATE Probe Needle Temperature Control Using a Thermal Model
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Solution Overview
Problem
Thermal stress on probe needles during IC testing leads to overheating and irreversible degradation, causing disrupted IC production and costly repairs.
Innovation Solution
A control device using a thermal model to estimate and regulate the temperature of DUT contacting structures, such as probe needles, by adjusting test signals to prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If current flow is increased to improve test speed and productivity, then productivity is improved, but thermal stress on probe needles increases leading to overheating and degradation
Solution Approach 1:
The system continuously monitors probe needle temperature during testing and uses this feedback to dynamically adjust test parameters. When temperature exceeds thresholds, the system automatically reduces current flow or pauses testing to prevent thermal damage, enabling sustained high-speed operation without degradation
Solution Approach 2:
The testing system transitions from static fixed-current operation to dynamic current adjustment based on real-time temperature conditions. The system adapts test parameters on-the-fly, varying current flow to maintain optimal temperature while maximizing productivity during different phases of the test cycle
2Temperature
If derating is applied to reduce probe needle temperature, then temperature is controlled, but test current is reduced limiting productivity
Solution Approach 1:
The system implements periodic temperature monitoring and alternating test phases between high-current rapid testing and low-current cooling periods. This periodic cycle allows the probe needles to be充分利用 at high current when cool, then cooled during low-current intervals, achieving both temperature control and high overall productivity
Solution Approach 2:
The system performs preliminary temperature assessment before initiating high-current testing and pre-cools probe needles when temperatures are elevated. By preparing the thermal state in advance, the system can safely apply maximum test current without immediately risking thermal damage
3Temperature
If thermal model and real-time temperature monitoring are implemented, then temperature control is improved, but device complexity increases
Solution Approach 1:
The system uses existing measurement infrastructure (voltage and current sensors already present in the ATE) to calculate temperature through thermal models, rather than adding dedicated temperature sensors. The system serves its own temperature monitoring needs using resources already available in the testing equipment
Solution Approach 2:
The system introduces a thermal model as a mathematical intermediary that translates easily measurable electrical parameters (voltage and current) into temperature information. This intermediary approach avoids direct thermal measurement complexity while providing accurate temperature control capability
4Manufacturing precision
If probe needles are made smaller to accommodate more contact pads, then manufacturing precision is improved, but mechanical strength decreases making them more susceptible to thermal damage
Solution Approach 1:
The system changes the operational parameters of the probe needles by严格控制 current density and duty cycle based on temperature feedback. By adjusting electrical parameters rather than mechanical dimensions, the system enables ultra-fine probe needles to operate safely at their size limit while maintaining both precision and thermal resilience
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents probe needle degradation and damage by maintaining temperatures below a threshold, ensuring reliable IC production with minimal system complexity and additional hardware requirements.
Implementation Method 1
Die temperature may be a specified test parameter; self-heating due to current flow creates further stress to the probe contact
Implementation Method 2
The probe needle consists of metal to conduct current to the DUT
Data Source
AI summary
Embodiments according to the disclosure comprise a control device for controlling an ATE for testing a DUT which is electrically coupled to the ATE using, or for example via, a device under test (DUT) contacting structure, e.g. using or via a probe needle, or for example using or via a DUT socket. The control device is configured to figure out a temperature of the DUT contacting structure using a thermal model, e.g. using a thermal model of the DUT contacting structure or using, for example, a thermal model comprising a thermal model of the DUT contacting structure. In addition, the control device is configured to influence, e.g. to control, to regulate, to deactivate and/or to limit, a signal applied to the DUT contacting structure based on the figured out, or for example modeled, temperature. The figured out temperature comprises at least one of a determined temperature or an estimated temperature.