ATI Pad Copper Discs for High Current Testing
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Solution Overview
Problem
Existing active thermal interposer (ATI)-based systems face challenges in transmitting high power without damaging the ATI pads and pins during device testing, leading to reduced equipment lifespan and increased downtime due to burn marks and contact resistance issues.
Innovation Solution
The implementation of copper discs on top of recessed pads in the ATI, which are electrically coupled to heater elements, helps spread heat and current, reducing the risk of burning and allowing for easier replacement, along with a thermal head design that uses dual pins or removable pin assemblies to distribute power effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high power (110V, 10A+) is transmitted through pogo pins and ATI pads during device testing, then thermal testing capability is improved, but the pads and pins are quickly damaged with burn marks appearing after roughly 100 cycles
Solution Approach 1:
The patent transitions from point-contact pads to planar contact surfaces by implementing a printed circuit board with multiple contact points distributed across the board surface. This dimensional change from 0D point contacts to 2D surface contacts distributes the high current and heat load across multiple locations, preventing concentration of stress and damage at single pad-pin interfaces.
Solution Approach 2:
The patent divides the single high-current transmission path into multiple parallel paths by using multiple contact points on the PCB. Each contact point handles a portion of the total current, segmenting the thermal and electrical load. This segmentation prevents any single pad or pin from bearing the full burden of 10A+ at 110V, thereby improving reliability.
2Temperature
If traditional ATI pads are used for high current transmission, then thermal control capability is improved, but contact resistance increases over time due to burn marks and degradation
Solution Approach 1:
The patent introduces a PCB as an intermediary component between the pogo pins and the ATI heating elements. This PCB intermediary provides a robust, distributed electrical connection system that mediates the high-current transmission, preventing direct stress on the ATI pads themselves. The PCB's trace network distributes current uniformly, maintaining stable contact resistance over extended testing cycles.
3Adaptability or versatility
If discrete thermal interposers are used with multiple zones, then thermal management flexibility is improved, but the number of voltage/current loops and connection points increases
Solution Approach 1:
The PCB serves multiple functions simultaneously: it provides electrical connection distribution, thermal management support, and mechanical structure for the testing apparatus. By making the PCB multi-functional, the patent reduces the need for separate components and connection mechanisms, thereby managing complexity while maintaining thermal management flexibility across multiple ATI zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution extends the lifespan of testing equipment, reduces downtime, and lowers operational costs by preventing pad and pin damage during high-power testing, while enabling more efficient thermal management.
Implementation Method 1
The implementation of copper discs on top of recessed pads in the ATI, which are electrically coupled to heater elements, helps spread heat and current
Implementation Method 2
The heaters are typically ceramic heaters made of high temperature co-fired ceramic (HTCC)
Data Source
AI summary
Embodiments of the present invention provide systems and methods for performing automated device testing at high power using ATI-based thermal management that substantially mitigates or prevents the pads and pins thereof from being burned or damaged. In this way, the lifespan of the testing equipment is improved and the expected downtime of testing equipment is substantially reduced, while also reducing cost of operation.