Atmosphere Communication Layer for Through Substrate DFR Deformation
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Solution Overview
Problem
During the processing of substrates with through holes, the deformation of dry film resist (DFR) layers occurs due to pressure fluctuations when the support member is peeled off or when the non-processed surface is exposed to a device, especially when the DFR is supported by a support member that is gas permeable.
Innovation Solution
A method involving the formation of a protective member with an atmosphere communication layer and a gas-impermeable protective layer on the substrate's surface, allowing the through hole to communicate with the atmosphere, which prevents scratches, chip formation, and adhesion of foreign matters, and enables the peeling of the support member without sealing the through hole, thus minimizing pressure fluctuations and deformation of the DFR.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a protective member is formed on the substrate surface to protect the front surface during back surface processing, then the front surface is protected from damage, but the through hole becomes sealed and pressure fluctuations occur causing DFR deformation
Solution Approach 1:
The protective member is divided into two functional layers: a gas-impermeable protective layer for surface protection and a gas-permeable atmosphere communication layer for pressure equalization. This segmentation allows each layer to perform its specific function independently, resolving the contradiction between protection and pressure control.
Solution Approach 2:
Different regions of the protective member have different gas permeability properties. The protective layer provides gas impermeability for protection, while the atmosphere communication layer provides gas permeability for pressure equalization. This local differentiation of properties allows simultaneous achievement of protection and pressure control.
2Ease of manufacture
If the support member is peeled off to complete the DFR processing, then the processing is completed, but pressure fluctuations occur causing DFR deformation
Solution Approach 1:
The atmosphere communication layer is prepared in advance as part of the protective member structure, enabling pressure equalization to occur automatically during the peeling process. This preliminary preparation prevents pressure fluctuations that would cause DFR deformation during support member removal.
3Stability of the object's composition
If the through hole is sealed during processing to maintain pressure, then pressure stability is improved, but the DFR deforms due to pressure fluctuations when peeling the support member
Solution Approach 1:
The atmosphere communication layer acts as an intermediary between the sealed through hole and the external atmosphere. It allows gradual pressure equalization through gas permeability, preventing sudden pressure fluctuations that would cause DFR deformation while maintaining overall pressure stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses the deformation of DFR layers during peeling and suction operations, ensuring the production of substrates with patterned resin layers that are less prone to deformation due to pressure fluctuations, enhancing the yield and quality of processed substrates.
Implementation Method 1
an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of layer side surface part to the through hole
Data Source
AI summary
A method of producing a structure having a through substrate includes: forming a protective member having an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of a layer side surface part to the through hole, and a gas-impermeable protective layer in this order, on the second surface of the through substrate; forming a dry film resist layer having a resin layer and a support member in this order, on the first surface of the through substrate; and peeling the support member from the resin layer, the support member being peeled from the resin layer in a state that the through hole of the through substrate is communicated with atmosphere by at least the atmosphere communication layer, in the peeling.