Compact Atomic Device Physics Package With Slotted Container
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Solution Overview
Problem
The assembly of chip-scale atomic devices, such as atomic clocks, is complicated by the need for precise positioning and thermal stabilization of components like VCSELs and vapor cells, which increases costs and precludes automated assembly methods.
Innovation Solution
A compact physics package with a container having slots for slidably receiving and aligning component carriers, allowing for easy assembly and sealing of VCSELs, vapor cells, and photodetectors, with electrical contacts for communication and thermal isolation using low thermal conductivity materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple component subsystems are assembled with precise positioning requirements, then alignment accuracy is improved, but assembly complexity increases
Solution Approach 1:
The device is divided into separate modular components (VCSEL module, vapor cell module, photodetector module, magnetic field coil module) that can be independently assembled and then integrated into the housing. Each module has standardized mounting features that simplify the overall assembly process while maintaining precise alignment requirements.
Solution Approach 2:
Alignment fixtures and mounting brackets serve as intermediary elements that facilitate precise positioning of optical components during assembly. These intermediaries provide reference surfaces and adjustment mechanisms that enable accurate alignment without requiring complex direct positioning between components.
2Temperature
If thermal stabilization components are added to maintain temperature, then temperature stability is improved, but device complexity increases
Solution Approach 1:
The thermal management function is merged with the structural housing by incorporating thermal conduction paths through the housing material itself. Heating elements and temperature sensors are integrated into the housing structure, eliminating the need for separate thermal stabilization components and reducing overall device complexity.
Solution Approach 2:
The housing serves multiple functions: it provides structural support, enables hermetic sealing, facilitates thermal management through conduction paths, and houses alignment fixtures. This multi-functionality reduces the need for additional dedicated components for each function.
3Reliability
If hermetic sealing is implemented to protect components, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The hermetic sealing function is merged into the housing structure itself through integrated sealing surfaces and gasket arrangements. The housing is designed with built-in sealing features that eliminate the need for separate sealing components, simplifying the manufacturing process while maintaining reliable hermetic protection of internal components.
4Productivity
If automated assembly methods are used to increase productivity, then productivity is improved, but assembly precision may deteriorate
Solution Approach 1:
The device is segmented into pre-assembled modules with standardized interfaces that can be quickly handled by automated assembly equipment. Each module maintains its internal alignment through precision manufacturing, and the standardized interfaces enable rapid integration without requiring complex automated alignment procedures.
Solution Approach 2:
Critical alignment features and reference surfaces are pre-established during module fabrication before final assembly. Alignment fixtures and mounting features are pre-positioned with high precision, allowing automated assembly systems to simply locate and connect modules without performing complex alignment operations during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies assembly and reduces packaging costs by enabling reproducible alignment and thermal management of components within a compact, hermetically sealed container, facilitating the use of automated assembly technologies.
Implementation Method 1
a lid sealably enclosing the open end, so that the vapor cell is sealably enclosed in the container
Implementation Method 2
thermal isolation using low thermal conductivity materials
Data Source
AI summary
A physics package apparatus for a compact atomic device includes a container having a plurality of slots and an open end, a first vapor cell carrier slidably seated in one of the plurality of slots, a vapor cell coupled to the first vapor cell carrier; and a lid sealably enclosing the open end so that the vapor cell is sealably enclosed in the container.