Atomic Layer Process Printer Spatial Deposition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current nanoscale manufacturing tools face challenges such as low processing speed, high material usage, complexity in processing multiple materials, and limited ability to create three-dimensional structures, particularly with Atomic Layer Deposition (ALD) methods which struggle with spatial selectivity and resolution.
Innovation Solution
An Atomic Layer Process Printer is developed with a movable substrate plate and printer head, featuring precise control over the movement in the X, Y, and Z planes, along with rotational and tilting angles, allowing for precise deposition, etching, and cleaning of materials with atomic-scale resolution and nanometer-level precision, enabling the creation of three-dimensional structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If temporal ALD is used for material deposition, then the process can be performed in a single chamber, but the processing speed is slow and a large amount of gas is required
Solution Approach 1:
The invention divides the deposition chamber into multiple independently controllable zones (first deposition zone, second deposition zone, etc.) along the substrate surface. Each zone can be subjected to different precursor gases simultaneously, enabling parallel deposition processes that increase productivity while reducing total gas consumption compared to temporal ALD which requires sequential processing of the entire chamber.
Solution Approach 2:
The invention transitions from temporal separation of deposition steps (processing one area at a time sequentially) to spatial separation (processing multiple areas simultaneously in different zones). This dimensional change from time-based to space-based processing enables parallel operations, improving processing speed while reducing overall material consumption.
2Productivity
If spatial ALD is used for faster deposition, then the deposition occurs locally and gas consumption is reduced, but three-dimensional structuring is not possible
Solution Approach 1:
The invention introduces movable components including a movable substrate plate that can be positioned in different locations (first position, second position, etc.) and a movable printer head. This dynamic repositioning capability allows the system to switch between planar deposition modes (for 2D patterning) and 3D deposition modes (by depositing on different faces of vertically positioned substrates), thereby enabling three-dimensional structuring while maintaining the fast deposition speeds of spatial ALD.
3Productivity
If existing nanoscale manufacturing tools are used, then material deposition can be achieved, but the processing speed is low and material usage is excessive
Solution Approach 1:
The invention implements localized deposition zones with independent precursor delivery systems. Each deposition zone can be precisely controlled to deposit material only where needed, with controlled thickness and composition. This local quality control enables fast deposition speeds while minimizing material waste by preventing unnecessary material deposition in unwanted areas, directly addressing both productivity and material consumption issues.
4Adaptability or versatility
If existing tools are used for processing multiple materials, then versatility is achieved, but the complexity increases excessively
Solution Approach 1:
The invention employs a universal precursor delivery system where multiple precursor gas sources can be connected to the same deposition chamber zones through a common distribution network. The system can switch between different precursor materials by controlling valve configurations and precursor supply, enabling processing of multiple materials (metals, semiconductors, insulators) without requiring separate dedicated tooling for each material type, thus achieving versatility with controlled complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The printer achieves high-resolution three-dimensional structuring with atomic-scale precision in the transverse direction and nanometer resolution in the lateral direction, enhancing material deposition speed and versatility while minimizing material consumption.
Implementation Method 1
The substrate in the chamber is typically subjected to a first precursor gas, which adsorbs on the surface
Implementation Method 2
Atomic Layer Deposition (ALD) is an example of a method used as a nanoscale manufacturing tool for printing of continuous films on flat surfaces
Data Source
AI summary
The invention relates to an atomic layer process printer for material deposition, etching and/or cleaning on an atomic scale in a selective area. The invention further relates to a method for material deposition, etching and/or cleaning on an atomic scale in a selective area using the atomic layer process printer.