Atomic Oscillator Bonding Structure for Self-Aligned Assembly
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Solution Overview
Problem
The existing atomic oscillator manufacturing process is complex and not suitable for mass production due to the need for precise positioning and bonding of connection members using resin adhesives, which requires dedicated devices and complicates the assembly process.
Innovation Solution
The atomic oscillator is designed with electrically conductive films on side surfaces of components, with bonding patterns formed on these films that are bonded using a conductive material like solder, allowing for self-alignment during assembly and eliminating the need for resin adhesives, thus simplifying the manufacturing process and enabling mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection members are fitted to the gas cell using resin adhesive bonding, then the gas cell can be supported and thermally connected, but the assembly process becomes complex and requires dedicated positioning devices
Solution Approach 1:
The connection members are designed with self-aligning features where protrusions on one member fit into corresponding recesses on the gas cell, enabling automatic positioning during assembly without requiring external positioning devices or complex alignment procedures
Solution Approach 2:
The resin adhesive bonding system is replaced with a mechanical interlocking system using protrusions and recesses, eliminating the need for adhesive application and curing processes while simplifying the overall assembly procedure
2Manufacturing precision
If precise positioning of connection members is required, then bonding accuracy can be achieved, but mass production becomes difficult
Solution Approach 1:
The positioning features (protrusions and recesses) are pre-formed on the connection members and gas cell during manufacturing, so that precise positioning is automatically achieved during assembly without requiring additional positioning operations or specialized equipment
Solution Approach 2:
The connection members are divided into modular components with standardized positioning features, allowing for rapid assembly and disassembly while maintaining precise positioning, thereby enabling mass production through efficient assembly lines
3Strength
If two connection members are used to fit the gas cell, then the gas cell is securely supported, but the assembly process becomes more complex
Solution Approach 1:
The support and thermal conduction functions are merged into a single integrated connection member design, where the protrusion- recess mechanism simultaneously provides mechanical support and thermal pathway, eliminating the need for separate components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the assembly process, reduces the need for specialized equipment, and enhances thermal management by minimizing heat dissipation through radiation, leading to a more efficient and cost-effective production of atomic oscillators.
Implementation Method 1
the connection members have a function for supporting the gas cell and a function for conducting heat from a heater on the substrate to the gas cell
Data Source
AI summary
An atomic oscillator includes a plurality of components, the components including a light source that emits excitation light, a gas cell in which an atom to be excited by the excitation light is sealed, and a photodetector that detects the excitation light transmitting through the gas cell; and a main part, wherein a part of the plurality of components are laminated in the main part. In a first component and a second component adjacent to each other of the main part, an electrically conductive film is formed on each of side surfaces of the first component and the second component; bonding patterns that are extended from the respective electrically conductive films and that face each other are formed on respective bonding surfaces facing each other of the first component and the second component; and the bonding patterns that face each other are bonded by a bonding material.