Atomization Core Resistive Layer Patterning Without Mask Alignment
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Solution Overview
Problem
The complexity and precision requirements of manufacturing atomization cores in electronic atomization devices, due to the use of masks for forming electrical resistive layers, increase processing costs.
Innovation Solution
A method of manufacturing atomization cores that involves forming a resistive layer on the entire surface of a raw substrate without a mask, then processing it to create electrically insulated regions that overlap with arrays of holes, eliminating the need for precise mask alignment and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mask is used to form the electrical resistive layer pattern on the raw substrate, then the manufacturing precision of the resistive layer pattern is improved, but the device complexity and processing cost increase
Solution Approach 1:
The patent removes the mask from the manufacturing process entirely. Instead of using a mask to define the resistive layer pattern, the invention directly forms the resistive layer with integrated heating zones and insulated regions through a simplified deposition process, eliminating mask alignment complexity while maintaining manufacturing precision
Solution Approach 2:
The patent inverts the conventional approach by forming the complete resistive layer pattern with insulated regions in a single deposition process rather than using a mask to define patterns sequentially. This inversion eliminates the need for mask alignment and reduces device complexity while achieving the required manufacturing precision
2Manufacturing precision
If a mask is used to form the electrical resistive layer pattern, then the pattern precision is improved, but the processing cost increases
Solution Approach 1:
The patent eliminates the mask and associated alignment processes from the manufacturing workflow. The resistive layer is formed directly with integrated patterns and insulated regions through a single deposition process, removing the need for expensive mask materials and alignment equipment while maintaining pattern precision
Solution Approach 2:
The patent inverts the conventional masked deposition approach by using a direct deposition method that forms the complete resistive layer pattern with insulated regions in one process step. This inversion eliminates mask-related costs and simplifies the manufacturing process while achieving the required manufacturing precision
3Productivity
If the resistive layer is formed on the entire surface first and then processed to create insulated regions, then the manufacturing efficiency is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary deposition of the resistive layer across the entire substrate surface before creating insulated regions. This preliminary action allows for efficient material deposition and enables subsequent precise definition of insulated regions through controlled material removal or insulation layer formation, achieving both high productivity and manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, improves efficiency, and reduces defects by eliminating the need for mask alignment, while ensuring effective heating and atomization performance.
Implementation Method 1
the atomization core includes a core substrate and an electrothermal film formed on the core substrate; Oil is heated by an atomization core of the electronic atomization device and is thereby atomized into aerosol
Data Source
AI summary
The disclosure provides a method of manufacturing an atomization core, an atomization core and an atomization device. The manufacturing method includes: providing a raw substrate, including a first surface and a second surface opposite to the first surface, and a plurality of substrate units, each of the substrate units defining an array of holes running through the first surface and the second surface; forming a resistive layer intermediate products first surface, and the resistive layer including a plurality of conductive parts corresponding to the substrate units, respectively. In this way, firstly, the resistive layer is formed on the entire first surface of the raw substrate, and then the conductive part of the resistive layer is processed so that the conductive part can form a first region that overlaps with the array of holes.