Atomization Core Resistance-Layer Patterning Without Mask Alignment
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Solution Overview
Problem
The complexity and cost of manufacturing atomization cores in electronic atomization devices are increased due to the use of masks for precise alignment of electrical resistance layers, leading to potential misalignment and substrate defects.
Innovation Solution
A method of forming a resistance layer on the entire surface of a raw substrate without a mask, followed by processing to create insulated regions that overlap with arrays of holes, eliminating the need for precise mask alignment and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mask is used to form the electrical resistance layer pattern on the raw substrate, then the alignment precision between the resistance layer and substrate holes is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts and removes the mask from the manufacturing process. Instead of using a mask to define the resistance layer pattern, the resistance layer is formed as a continuous film covering the entire substrate surface, and the desired pattern is achieved by selectively removing material elsewhere, thereby eliminating mask-related complexity and alignment issues
Solution Approach 2:
The patent inverts the conventional approach: instead of forming the resistance layer pattern directly through mask alignment, a continuous resistance layer is formed first, and then other materials are selectively removed to create the final pattern. This inversion eliminates the need for precise mask alignment while achieving the same functional result
2Manufacturing precision
If a mask is used to form the electrical resistance layer pattern on the raw substrate, then the pattern alignment is improved, but the manufacturing cost increases
Solution Approach 1:
The mask is extracted and removed from the process. The continuous resistance layer formation followed by selective material removal eliminates mask procurement, alignment setup, and disposal costs, directly reducing manufacturing expenses while maintaining pattern alignment
Solution Approach 2:
The patent replaces the expensive, precision-critical mask with a simple continuous film deposition process followed by inexpensive selective removal. The continuous resistance layer acts as a disposable foundation that is later patterned through material removal, eliminating the need for costly reusable masks
3Manufacturing precision
If the resistance layer is formed only on specific substrate units using mask alignment, then the precision of resistance layer placement is improved, but the manufacturing efficiency decreases
Solution Approach 1:
The patent merges the formation of resistance layers across all substrate units into a single continuous deposition process. Instead of individually patterning each substrate unit through mask alignment, a continuous resistance layer is formed across the entire substrate surface in one step, dramatically improving manufacturing efficiency
Solution Approach 2:
The continuous resistance layer is formed as a preliminary step before final patterning. This preliminary action covers the entire substrate surface upfront, allowing subsequent selective removal processes to work in parallel across multiple substrate units, thereby improving overall manufacturing throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, improves efficiency, and reduces defects by eliminating the need for mask alignment, ensuring proper functioning of the atomization core.
Implementation Method 1
the atomization core includes a core substrate and an electrical resistance layer formed on the core substrate as an electrothermal film
Data Source
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AI summary
The disclosure provides a method of manufacturing an atomization core, an atomization core and an atomization device. The manufacturing method includes: providing a raw substrate, including a first surface and a second surface opposite to the first surface, and a plurality of substrate units, each of the substrate units defining an array of holes running through the first surface and the second surface; forming a resistance layer intermediate products first surface, and the resistance layer including a plurality of conductive parts corresponding to the substrate units, respectively. In this way, firstly, the resistance layer is formed on the entire first surface of the raw substrate, and then the conductive part of the resistance layer is processed so that the conductive part can form a first region that overlaps with the array of holes. Compare with forming a single substrate unit first and then setting the conductive layer on the single substrate unit, the manufacturing method is more efficient and can save the cost of manufacturing the atomization core.