Atomization Assembly Embedding Heating Body in Porous Ceramic Matrix
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Solution Overview
Problem
Existing electronic atomization devices face issues with non-uniform resistance and temperature distribution in the heating film due to localized density inhomogeneity and internal microscopic defects, leading to warping, cracking, and reduced service life, along with high fabrication costs and inefficiencies in liquid permeation.
Innovation Solution
An atomization assembly with a porous ceramic matrix and a heating body, where the heating body is embedded within the matrix using fixing parts to ensure secure mounting and uniform heat distribution, made from materials like FeCrAl alloy, and fabricated through a method involving high-temperature sintering to form a dense oxide film for improved reliability and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If screen printing method is used to form heating film, then heating film can be formed on ceramic surface, but localized density inhomogeneity of electronic paste results in non-uniform resistance and temperature distribution
Solution Approach 1:
The patent replaces the screen printing mechanical process with an embedding method where metal particles are incorporated into the ceramic matrix during sintering. This substitution eliminates the paste printing step that causes density inhomogeneity, achieving uniform resistance distribution through a simpler one-step sintering process.
Solution Approach 2:
The patent changes the manufacturing parameters from multi-step screen printing with paste deposition to a single-step sintering process with metal particle embedding. This parameter change transforms the complex printing process into a controlled sintering process, achieving uniform resistance through precise control of sintering temperature and particle distribution.
2Reliability
If heating film is formed by sintering and jointing alloy particles, then heating film can be created, but internal microscopic defects cannot be eliminated leading to poor temperature uniformity and stress concentration
Solution Approach 1:
The patent creates a composite material structure where metal particles are uniformly embedded within the ceramic matrix during sintering. This composite approach eliminates internal defects by integrating the heating elements directly into the matrix, achieving both high reliability and uniform temperature distribution through the homogeneous composite structure.
3Productivity
If heating film is disposed above ceramic surface with alloy particles, then heating film can be formed, but film width and thickness cannot be reduced making liquid permeation difficult
Solution Approach 1:
The patent embeds the heating elements within the ceramic matrix structure, nesting the metal particles inside the matrix rather than placing them on the surface. This nested configuration allows the heating film to be integrated at the micro-scale within the matrix, enabling thin film formation while maintaining excellent liquid permeation through the porous matrix structure.
4Strength
If heating film is tightly attached to ceramic surface, then heating film can be fixed, but thermal oscillation during vaping causes local stress leading to cracking and peeling
Solution Approach 1:
The patent merges the heating elements with the ceramic matrix by embedding metal particles directly into the matrix during sintering. This combining creates an integrated structure where the heating film and ceramic substrate become a unified whole, eliminating the interface between separate layers and preventing stress-induced cracking and peeling while maintaining strong attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability and service life of the atomization assembly by ensuring uniform temperature distribution and stress management, reducing the risk of cracking and dry burning, while also simplifying the manufacturing process and reducing costs.
Implementation Method 1
a porous matrix for sucking in and conducting the liquid medium
Implementation Method 2
a heating body mounted on the porous matrix for heating and atomizing the liquid medium
Implementation Method 3
heating and atomizing the liquid medium
Data Source
AI summary
Provided are an electronic atomization device and an atomization assembly thereof, and a manufacturing method of the atomization assembly. The atomization assembly includes a porous matrix and a heating body. The porous matrix includes an atomization face. The heating body includes a heating part and at least one fixing part connected to the heating part. The at least one fixing part is embedded in the porous matrix, such that the heating body is mounted on the porous ceramic matrix and the heating part is arranged to correspond to the atomization face. The beneficial effect is that mounting of the heating body is realized by having the fixing part embedded in the porous matrix to improve reliability of the atomization assembly.