Atomization Mechanism for Bond Head Cooling
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Solution Overview
Problem
Conventional methods for cooling bond heads in bonding machines are inefficient, especially for compact bond heads with small heaters, as they require large apparatus and limited water spray due to small nozzle openings, resulting in unsatisfactory cooling rates.
Innovation Solution
An atomization mechanism that forms an atomized spray using a module external to the bond head, which is conveyed through a conduit to the bond head, allowing for controlled gas and liquid flow to enhance cooling efficiency and compactness, including a separating mechanism to separate the spray into liquid and gas, reducing the need for radiators and improving heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If spray nozzles are installed inside the bond head to cool the heater, then the cooling rate increases, but the bond head size must be increased to accommodate the nozzles
Solution Approach 1:
The spray nozzle is extracted from the bond head and positioned externally. The nozzle is mounted on a moving platform that can position it close to the bond head heater surface without increasing the bond head volume. This allows the cooling function to be separated from the bonding function, resolving the contradiction between cooling efficiency and compactness.
Solution Approach 2:
A moving platform acts as an intermediary between the spray nozzle and the bond head. This platform enables precise positioning of the nozzle near the heater surface while keeping the bond head itself compact. The intermediary structure allows the cooling system to be decoupled from the bonding apparatus volume.
2Volume of moving object
If spray nozzles with small openings are used in compact bond heads, then the bond head remains compact, but the amount of water spray is limited reducing cooling effectiveness
Solution Approach 1:
The spray nozzle is extracted from the constrained internal space of the bond head and positioned externally where it can be much larger. This external positioning removes the volume constraint, allowing the use of large-orifice nozzles that can deliver high volumes of cooling spray without compromising bond head compactness.
Solution Approach 2:
The cooling system is moved from the internal three-dimensional space of the bond head to an external position where spatial constraints are different. By operating from an external moving platform, the spray nozzle accesses a different spatial dimension that is not constrained by the bond head housing, enabling larger spray volumes.
3Volume of moving object
If conventional cooling methods are used with compact bond heads, then the apparatus remains compact, but the cooling rate remains unsatisfactory
Solution Approach 1:
The conventional internal spray nozzle mechanical system is replaced with an external moving platform system. This substitution allows for a different mechanical arrangement where a large-capacity nozzle can be positioned close to the bond head without being constrained by internal mounting, achieving both compactness and high cooling rate.
Solution Approach 2:
The cooling system is made dynamic through the moving platform that can adjust the nozzle position relative to the bond head. This dynamic positioning allows the system to optimize the spray distance and angle for maximum cooling efficiency while maintaining compact overall apparatus size, outperforming static conventional systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The atomization mechanism increases cooling rates, enhances productivity, and allows for more compact bonding apparatus designs, with improved control over the cooling process and early detection of leakage, leading to reduced production disruptions.
Implementation Method 1
an atomization module configured to receive gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray
Implementation Method 2
Using an atomized spray to cool the bond head increases the rate of cooling the bond head
Implementation Method 3
The collet is then heated to about 350 degrees Celsius using a heater assembled in the bond head
Implementation Method 4
Such heating melts the solder balls attached with the electronic device
Data Source
AI summary
An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.