Atomizer Heating Film Layout for High Porosity Without Burnout
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Solution Overview
Problem
Existing heating assemblies in electronic atomization devices face stability issues due to increased resistance and failure rates when hole density is increased to improve porosity, leading to cracking and burnout from high local heat flux.
Innovation Solution
A heating assembly design with liquid guiding holes arranged at higher density in one direction and equal density in the perpendicular direction, maintaining consistent cross-sectional area and resistance, ensuring stability while enhancing porosity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the density of through holes is increased to improve porosity, then the porosity of the heating assembly is improved, but the resistance of the heating film increases and stability deteriorates
Solution Approach 1:
The patent applies asymmetry by arranging liquid guiding holes with different densities in different directions. Specifically, the holes are arranged more densely in the direction perpendicular to the current flow direction while maintaining larger spacing in the direction parallel to current flow. This asymmetric arrangement allows increased overall porosity while preserving sufficient heating film area and structural integrity in the critical current flow direction, thereby resolving the contradiction between porosity improvement and heating film stability.
2Quantity of substance
If the spacing between holes is reduced to increase hole density, then the porosity is improved, but the resistance of the heating film increases causing failures
Solution Approach 1:
The patent applies local quality by creating directionally differentiated hole arrangements. In the direction perpendicular to current flow, holes are arranged with smaller spacing to maximize porosity and liquid guidance. In the direction parallel to current flow, holes maintain larger spacing to preserve heating film continuity, reduce resistance, and prevent failures. This localized variation in hole density according to functional requirements resolves the contradiction between hole density and reliability.
3Ease of manufacture
If uniform hole arrangement is used to increase porosity, then the manufacturing is simplified, but the heating film experiences high local heat flux causing cracking and burnout
Solution Approach 1:
The patent resolves the contradiction by implementing asymmetric hole arrangement that is still manufacturable. The asymmetric pattern (different spacing in different directions) can be achieved through standard photolithography and drilling processes by simply adjusting the hole coordinate parameters. This maintains ease of manufacture while effectively distributing heat flux by preventing excessive hole concentration in any single direction, thereby eliminating cracking and burnout issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design stabilizes the heating film by maintaining consistent resistance and reducing failure risks, while increasing porosity for efficient atomization without cracking or burnout.
Implementation Method 1
The relatively common atomization method for existing heating assemblies is resistance heating. Specifically, the heating assembly includes a substrate and a heating film disposed on the surface of the substrate.
Implementation Method 2
The substrate is provided with a plurality of liquid guiding holes that run through the liquid absorbing surface and the atomizing surface
Data Source
AI summary
A heating assembly, an atomizer, and an electronic atomization device are provided. The heating assembly includes a substrate and a heating film. The substrate includes a liquid absorbing surface and an atomizing surface that are oppositely disposed. The substrate is provided with a plurality of liquid guiding holes that go through the liquid absorbing surface and the atomizing surface. The heating film is disposed on the atomizing surface, the liquid guiding holes extend through the heating film. A density of the plurality of liquid guiding holes in a first direction is greater than a density of the plurality of liquid guiding holes in a second direction.