Atomizer Heating Assembly with Segmented Liquid Guide Channels
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Solution Overview
Problem
Existing heating assemblies in electronic atomization devices face issues with insufficient liquid supply leading to gas backflow and liquid spitting due to varying aperture sizes of through-holes in the substrate, which affect the atomization process.
Innovation Solution
A heating assembly with a substrate featuring liquid guide channels that have overlapping ports on the atomization surface and spaced ports on the liquid absorption surface, along with specific dimensions and arrangements of liquid guide holes to ensure sufficient liquid supply and reduce gas backflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the aperture of the through-hole is made small, then gas backflow is reduced, but liquid supply becomes insufficient leading to heating film burnout
Solution Approach 1:
The invention divides a single through-hole into multiple liquid guide holes (at least two) within the same liquid guide channel. This segmentation allows the system to benefit from multiple smaller openings that collectively provide sufficient liquid supply while maintaining low individual aperture sizes to prevent gas backflow. The liquid guide channel structure with multiple holes resolves the contradiction by distributing liquid flow across several small openings rather than relying on a single large opening.
Solution Approach 2:
The invention creates different local structures within the liquid guide channel: the liquid guide holes have small apertures to prevent gas backflow, while the liquid guide channel provides a larger overall pathway for liquid supply. The substrate structure is optimized locally with through-holes arranged in specific patterns, creating regions with different functional characteristics - some areas with smaller effective apertures for gas prevention and others ensuring adequate liquid delivery to the heating film.
2Quantity of substance
If the aperture of the through-hole is made large, then liquid supply is sufficient, but liquid spitting with noise occurs
Solution Approach 1:
By segmenting the liquid guide channel into multiple liquid guide holes, the invention distributes the liquid flow across several smaller openings. This segmentation prevents liquid spitting that occurs with single large holes, as the smaller individual apertures provide better flow control and reduce the likelihood of liquid ejection with noise, while still maintaining sufficient total liquid supply through the combined effect of multiple holes.
Solution Approach 2:
Instead of using a single large through-hole that causes liquid spitting, the invention inverts the approach by using multiple small liquid guide holes within a liquid guide channel structure. This inverted design achieves sufficient liquid supply through cumulative effect of multiple small openings rather than relying on a single large opening, thereby preventing liquid spitting and associated noise.
3Quantity of substance
If multiple through-holes are distributed independently, then liquid supply paths are increased, but gas backflow occurs due to high liquid guidance resistance
Solution Approach 1:
The invention merges multiple liquid guide holes into a unified liquid guide channel structure. Rather than having independently distributed through-holes that create high liquid guidance resistance, the liquid guide holes are combined within a common channel that provides a continuous, low-resistance pathway for liquid flow. This merging reduces liquid guidance resistance while maintaining multiple openings to prevent gas backflow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances liquid feeding efficiency, prevents liquid spitting, and reduces gas backflow by optimizing the design of liquid guide channels, ensuring optimal aerosol production and user experience.
Implementation Method 1
the liquid guide channel includes at least two liquid guide holes, and the liquid guide holes run through the liquid absorption surface and the atomization surface
Implementation Method 2
A relatively common atomization manner for an existing heating assembly is resistive heating
Data Source
Figure 1~2
Figure 3~5a
Figure 5b~6a
AI summary
This application discloses a heating assembly, an atomizer, and an electronic atomization device. The heating assembly includes: a substrate, including a liquid absorption surface and an atomization surface that are oppositely disposed, where at least one liquid guide channel that runs through the liquid absorption surface and the atomization surface is provided on the substrate; and the liquid guide channel includes at least two liquid guide holes, and the liquid guide holes run through the liquid absorption surface and the atomization surface; and ports that are of two adjacent liquid guide holes in the liquid guide channel and that are located on the atomization surface overlap with each other and ports that are of two adjacent liquid guide holes and that are located on the liquid absorption surface are spaced apart from each other. Ports that are of two adjacent liquid guide holes in the liquid guide channel and that are located on the atomization surface overlap with each other, so as to increase the volume porosity on the atomization surface, improve the liquid feeding effect, and ensure sufficient liquid feeding. Ports that are of two adjacent liquid guide holes in the liquid guide channel and that are located on the liquid absorption surface are spaced apart from each other, so as to avoid an excessively large amount of liquid to be provided on the atomization surface, thereby preventing liquid spitting, and helping to reduce backflow during heating and atomization.