ATSC 3.0 Receiving Apparatus Channel Bonding Circuit

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Solution Overview

Problem

Conventional technologies for receiving terrestrial digital broadcasting compliant with the ATSC 3.0 standard lack receiving-side specifications for channel bonding, which is essential for improving frequency band utilization efficiency.

Innovation Solution

A receiving apparatus is designed with multiple integrated circuits and circuits that demodulate, decode, and bond packets received via different frequency channels, ensuring efficient reconstruction of the stream by exchanging and synchronizing data cells and packets, and determining error-free bonding conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If channel bonding is implemented to improve frequency band utilization efficiency, then the frequency band utilization efficiency is improved, but the device complexity increases due to the need for multiple integrated circuits and coordination mechanisms

Engineering Contradiction:
Improvefrequency band utilization efficiencyVSAvoiddevice complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The receiving apparatus is divided into multiple integrated circuits, where each circuit is responsible for decoding packets from specific frequency channels. This segmentation allows parallel processing of multiple channels while maintaining manageable complexity within each circuit module.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A bonding section acts as an intermediary component that receives decoded packets from multiple integrated circuits, bonds them together in the correct sequence, and reconstructs the original stream. This mediator coordinates the outputs from different circuits without requiring complex inter-circuit communication.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If multiple integrated circuits are used for decoding packets from different frequency channels, then the frequency band utilization efficiency is improved, but the ease of manufacture deteriorates due to the complexity of integrating multiple circuits

Engineering Contradiction:
Improvefrequency band utilization efficiencyVSAvoidease of manufacture
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The system is segmented into independent integrated circuit modules that can be designed, tested, and manufactured separately. Each circuit handles a specific frequency channel, allowing for modular manufacturing and assembly.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The integrated circuits are designed with universal interfaces and standardized packet formats that allow them to work together in different configurations. The bonding section uses generic bonding logic that can accommodate packets from any number of channels, making the system adaptable without requiring custom integration for each configuration.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If cell exchange is implemented between integrated circuits, then the reliability of packet reconstruction is improved, but the loss of time increases due to the exchange and coordination overhead

Engineering Contradiction:
ImprovereliabilityVSAvoidloss of time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

Packets are pre-numbered with sequence identifiers during the decoding process in each integrated circuit. This preliminary tagging allows the bonding section to quickly sort and reconstruct packets in the correct order without requiring complex real-time coordination or exchange protocols between circuits.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The bonding section monitors the reconstruction process and uses feedback from packet sequence validation to detect and correct any ordering issues. This feedback mechanism ensures reliable reconstruction while minimizing the time required for verification through efficient error detection.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS11516533B2Receiving apparatus, communication system, and receiving apparatus control method
Publication Date: 2022.11.29 SONY SEMICON SOLUTIONS CORP
  • US11516533B2 patent drawing
  • US11516533B2 patent drawing
  • US11516533B2 patent drawing

AI summary

Channel bonding is realized in a receiving apparatus that receives terrestrial digital broadcasting compliant with an ATSC 3.0 standard. A first receiving circuit receives a first frame obtained by encoding first packets within a stream containing the first packets and second packets via a first frequency channel. A second receiving circuit receives a second frame obtained by encoding the second packets via a second frequency channel different from the first frequency channel. A first integrated circuit decodes the first frame and acquires the first packets. The second integrated circuit performs processing for decoding the second frame and acquiring the second packets and processing for bonding the first packets and the second packets together and reconstructing the stream.