Atypical Interposer Layout for Riser-Free IC Package Validation
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Solution Overview
Problem
The use of a riser in validation frameworks for IC packages leads to signal integrity issues, increased cost, and reduced high-speed interface performance due to its thickness, which is often three times that of the package substrate, and constitutes a significant portion of the electrical path.
Innovation Solution
Employing an atypical shaped interposer that eliminates the need for a riser by directly coupling IC packages to a validation framework, reducing mechanical obstacles and optimizing signal routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a riser is used to elevate the interposer above mechanical obstacles, then the interposer can clear obstacles on the reference platform, but the riser thickness (three times the package substrate thickness) degrades signal integrity and high-speed interface performance
Solution Approach 1:
The patent removes the riser component entirely from the validation framework. The interposer is redesigned to sit directly on the reference platform without the intermediate riser structure, eliminating the thickness-related signal integrity issues while maintaining the ability to clear obstacles through proper interposer positioning
Solution Approach 2:
The patent transitions from a vertical stacking approach (package substrate -> interface socket -> riser -> interposer) to a more integrated layout where the interposer sits directly on the reference platform. This dimensional reorganization eliminates the excessive thickness in the electrical path while maintaining functional separation
2Shape
If a riser is used to elevate the interposer, then mechanical obstacles are avoided, but the riser constitutes 45% of the validation framework cost and 70% of the electrical path length
Solution Approach 1:
The riser component is completely removed from the validation framework architecture. The interposer is redesigned to function without the riser, eliminating 45% of the framework cost and 70% of the unnecessary electrical path length while maintaining obstacle clearance capability through direct mounting
Solution Approach 2:
The patent merges the interposer directly with the reference platform by eliminating the riser intermediate structure. This consolidation reduces component count, simplifies the electrical path, and lowers overall system cost while maintaining functional performance
3Shape
If a traditional validation framework with riser is used, then the interposer can be positioned above obstacles, but deviations from reference designs increase and compatibility with reference platforms decreases
Solution Approach 1:
The riser is removed to eliminate the structural deviation from standard reference platform designs. The interposer is redesigned to mount directly on the platform, improving compatibility while maintaining positioning capability through alternative mechanical design
Solution Approach 2:
The patent changes the mounting parameters of the interposer from elevated positioning (via riser) to direct surface mounting. This parameter change improves compatibility with reference platforms while maintaining the ability to position the interposer correctly through adjusted mechanical features on the interposer itself
Data Source
AI summary
In one embodiment, an apparatus includes an integrated circuit (IC) socket and an interposer. The IC socket includes a cavity to receive an IC package including first and second sets of IC contacts, the cavity defined by a base including a set of IC socket interconnects and a frame extending from the base with at least one opening through the frame. The interposer includes a cavity portion disposed adjacent the base of the IC socket, an external portion extending from the cavity portion through one of the at least one opening, at least one connector disposed on the external portion, a first set of interposer interconnects to electrically couple each of the first set of IC contacts with a corresponding one of the set of IC socket interconnects, and a second set of interposer interconnects to electrically couple each of the second set of IC contacts with one of the at least one connector. Other embodiments are described and claimed.