Automotive Audio Amplifier Cooling Plate with Studs and Fins
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Solution Overview
Problem
Existing audio amplifiers for automotive applications face challenges in efficiently dissipating heat due to inefficient heat transfer from the electronic board to the fins, and their design is not suitable for compact installations within vehicles.
Innovation Solution
The audio amplifier design includes a shell connected to a bottom wall, forming a closed housing space, with a cooling plate having a finned portion and studs that transfer heat from the electronic card to the cooling plate. A fan generates air flow through the duct system to efficiently transport heat away from the amplifier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the electronic card is positioned inside the container with fins on the outside surface, then heat dissipation is provided, but the heat transfer from the electronic board to the fins is not efficient
Solution Approach 1:
The patent introduces a thermal paste layer as an intermediary substance between the electronic board and the heat dissipation fins. This thermal paste fills the microscopic gaps and air pockets between the contacting surfaces, providing a continuous thermal conduction path that significantly improves heat transfer efficiency from the electronic components to the fins.
Solution Approach 2:
The patent extracts the air layer (which is a poor thermal conductor) between the electronic board and fins by replacing it with thermal paste. This removal of the thermal barrier allows direct and efficient thermal contact between the heat-generating components and the heat dissipation structure.
2Volume of moving object
If the audio amplifier is designed with reduced dimensions for automotive application, then compactness is achieved, but heat dissipation efficiency is reduced
Solution Approach 1:
The patent extends the heat dissipation structure in the vertical dimension by adding fins that protrude from the container surface. This dimensional extension increases the heat dissipation surface area without increasing the horizontal footprint, allowing efficient heat dissipation within compact automotive installation spaces.
Solution Approach 2:
The patent nests the electronic board within the container, which itself is integrated into the amplifier housing. The heat dissipation fins are nested on the outer surface of the container, creating a compact nested structure where each component is positioned within the space of the previous component, maximizing space utilization.
3Temperature
If the fins are arranged to provide heat dissipation, then thermal management is improved, but the amplifier is not suitable for mounting inside a vehicle
Solution Approach 1:
The patent designs the container to serve multiple functions: it acts as the housing for the electronic board, provides the mounting structure for the fins, and serves as part of the overall amplifier enclosure. This multi-functionality allows the same structure to provide both heat dissipation and vehicle mounting capability.
Solution Approach 2:
The patent merges the heat dissipation function with the structural housing function by integrating the fins directly onto the container that houses the electronic board. This combination eliminates the need for separate heat sinks and mounting brackets, creating a unified structure suitable for automotive installation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat in a compact form factor, suitable for automotive installations, while protecting the electronic card from external contaminants by isolating the air flow path from the components.
Implementation Method 1
The purpose of the studs of the plurality of studs is to transfer heat generated by the electronic card (that is, by the electronic components) to the cooling plate, in an efficient manner
Implementation Method 2
A fan is provided, configured for generating a flow of air through the dust system
Implementation Method 3
The cooling plate is provided with a finned portion. The finned portion projects from the outside face. In particular, the finned portion includes a plurality of fins
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
Described is an audio amplifier (1) for automotive applications comprising: a bottom wall (12), a shell (11), connected to the bottom wall (12) to form a housing space interposed between them and including a cooling plate (111), parallel to the bottom wall (12) and having an inside face (111A), facing the housing space, and an outside face (111B), the cooling plate (111) being provided with a finned portion (111C) projecting the outside face (111B) and a plurality of studs (111F) projecting from the inside face (111A) in the housing space, towards the bottom wall (12); an electronic card (15), positioned in the housing space and including a plurality of electronic components, positioned on the card (15) in such a way that the studs (111F) of the plurality of studs of the cooling plate (111) are abutted against them in contact; a lid (13), fixed to the shell (11) and positioned parallel to the bottom wall (12), in such a way that the finned portion (111C) is interposed between the lid (13) and the outside face (111B) of the cooling plate (111) for defining a duct system; a fan (14), positioned between the lid (13) and the outside face (111A) of the cooling plate (111), for generating a flow of air through the duct system.