Digital Audio Array Circuit Synchronization via TDM Master
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Solution Overview
Problem
Current digital audio transmission protocols, such as I2S and TDM, face challenges in cost and complexity when scaling audio chip arrays, with I2S requiring additional processing units and TDM causing time offsets that hinder noise reduction processing.
Innovation Solution
A digital audio array circuit comprising multiple digital audio units and a system master unit, where all units receive a synchronized signal to perform sound wave sampling synchronously, reducing the need for additional processing units and eliminating time offsets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If I2S audio transmission protocol is used to connect multiple audio chips, then sound wave sampling can be synchronized, but additional processing units or decoders are required for every two audio chips, causing cost and volume increase
Solution Approach 1:
Multiple audio chips are merged into a single TDM audio chip array circuit, combining their sampling operations under unified control. The system master unit coordinates all slave audio chips to sample simultaneously, eliminating the need for separate processing units for each chip pair while maintaining synchronization through the shared TDM bus and common clock signal.
2Device complexity
If TDM audio transmission protocol is used to connect multiple audio chips, then circuit volume is reduced and no additional processing units are needed, but each audio chip is sampled with a time offset, which is not conducive to noise reduction processing
Solution Approach 1:
The system introduces dynamic time alignment through the system master unit, which receives timing information from each slave audio chip and adjusts their sampling operations accordingly. The master unit sends control signals to synchronize the sampling start times of all slave chips, dynamically compensating for any time offsets while maintaining the simplified TDM architecture without additional processing units.
3Reliability
If more audio chips are connected to achieve better audio reception, then audio quality improves, but I2S protocol requires more processing units and decoders, increasing cost and complexity
Solution Approach 1:
The system master unit serves multiple slave audio chips simultaneously through a single TDM interface, making the master unit universal in its control capability. Each slave audio chip can be independently configured and controlled by the master unit, allowing the system to scale from 2 to N chips without proportionally increasing the number of processing units or decoders, thus reducing overall system complexity and cost.
Data Source
AI summary
A digital audio array circuit is provided. The digital audio array circuit includes at least two digital audio units and a system master unit. Each of the digital audio units is configured to transform a received sound wave to a digital audio signal. Each of the digital audio units includes a left/right channel configuration input terminal. The system master unit is connected to the at least two digital audio units in time division multiplexing to receive the digital audio signals. The left/right channel configuration input terminal of each of the digital audio units is configured to receive a same synchronizing signal.