Audio Jack Assembly Housing Mounting

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Solution Overview

Problem

Conventional portable computing devices face design challenges with audio jacks attached to the main logic board, leading to reduced layout efficiency, potential damage from connector stress, and difficult repair due to the audio jack's placement, which restricts internal component arrangement and increases the risk of short circuits.

Innovation Solution

An audio jack assembly is mounted directly to the interior sidewall of the portable computing device housing using angled flanges, a cantilevered support beam, and an angled connector for self-alignment, allowing for a minimum stand-off distance and easier installation, reducing stress on the main logic board and simplifying repair.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the audio jack is attached directly to the main logic board, then the assembly is simpler, but the layout efficiency is reduced and the reliability is compromised due to stress on the logic board

Engineering Contradiction:
Improveassembly complexityVSAvoidlogic board reliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The audio jack assembly is separated from the main logic board into an independent module mounted on the housing. This segmentation allows the audio jack to be assembled separately and mounted via angled flanges to the housing, eliminating direct attachment to the logic board and preventing stress-induced damage while maintaining assembly simplicity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The housing serves as an intermediary structure between the audio jack and the main logic board. The audio jack is mounted to the housing rather than directly to the logic board, transferring mechanical loads to the housing and preventing stress concentration on the logic board while maintaining electrical connectivity through the housing's internal structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If the audio jack is attached directly to the main logic board, then the number of components is reduced, but the ease of repair is worsened due to risk of short circuits and damage to nearby components

Engineering Contradiction:
Improvenumber of componentsVSAvoidaudio jack repairability
Core Design Contradiction:
Device complexityVSEase of repair

Solution Approach 1:

The audio jack is segmented into a separate module with its own housing and mounting structure. This modular design allows the audio jack to be removed and replaced independently from the main logic board, eliminating the risk of damaging nearby components during repair while maintaining a compact overall structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The audio jack assembly is extracted from the main logic board structure and mounted independently on the housing. This extraction enables the audio jack to be serviced, removed, or replaced without affecting the logic board or other nearby components, significantly improving repairability while maintaining component integration.

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of manufacture

If the audio jack is attached directly to the main logic board, then the manufacturing process is simpler, but the layout efficiency is reduced due to positioning restrictions

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidlayout efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The housing acts as an intermediary mounting surface for the audio jack, decoupling the audio jack's position from the logic board's position. This allows the logic board to be optimized for electrical routing and component placement while the audio jack is positioned on the housing for optimal acoustic and mechanical performance, improving overall layout efficiency without complicating manufacturing.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The audio jack mounting is moved from the two-dimensional plane of the logic board to the three-dimensional housing structure. The angled flanges provide spatial orientation and positioning in multiple dimensions, allowing flexible placement of the audio jack relative to the logic board and optimizing the overall device layout for both manufacturing and performance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS8837128B2Electrical component for portable computing device
Publication Date: 2014.09.16 APPLE INC
  • US8837128B2 patent drawing
  • US8837128B2 patent drawing
  • US8837128B2 patent drawing

AI summary

The present application describes various embodiments regarding an apparatus and method for providing an electrical component for a portable computing device. More specifically a method and apparatus are disclosed for mounting the electrical component to machined mounts extending from an interior sidewall of the portable computing device housing. The machined mounts allow the electrical component to be suspended above an inner surface of the portable computing device so that the electrical component does not interfere with audio output or aesthetics of a speaker grill drilled into the portable computing device housing.