Authentication IC Temperature Profiling for Toner Part Verification

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Solution Overview

Problem

Existing image forming apparatuses face challenges in precisely authenticating replacement parts, particularly toner containers, due to the potential for reverse engineering and imitation, which can lead to incorrect authentication and consumption of non-compatible consumables.

Innovation Solution

Incorporation of a semiconductor device with a load element, switching element, and processor that controls temperature according to a specific temperature profile, allowing for precise authentication by detecting and matching the temperature profile of the authentication IC, thereby distinguishing between authentic and counterfeit replacement parts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a simple authentication method is used, then the device complexity is reduced, but the authentication reliability deteriorates due to potential reverse engineering and imitation

Engineering Contradiction:
Improveauthentication system complexityVSAvoidauthentication reliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent changes the parameter being authenticated from static data (authentication codes stored in IC chips) to dynamic physical characteristics (temperature profiles). The authentication system measures temperature changes over time and compares them against registered profiles, making reverse engineering significantly more difficult while maintaining reasonable device complexity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the mechanical/electronic authentication system (IC chip reading) with a thermal authentication system. Instead of reading authentication data from an IC chip, the system uses temperature detection and profile matching, substituting one authentication mechanism with another that is more resistant to reverse engineering

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If temperature control is added to the authentication IC, then the authentication precision is improved, but the manufacturing complexity increases

Engineering Contradiction:
Improveauthentication precisionVSAvoidauthentication IC manufacturing ease
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The authentication IC is designed to perform multiple functions: it serves as both the authentication credential and the temperature control actuator. The IC contains a load element for temperature control, a switching element for controlling current flow, and a processor for managing the temperature profile, making it a multi-functional component that improves authentication precision while consolidating manufacturing requirements

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables precise authentication of replacement parts, preventing incorrect identification and ensuring compatibility with the image forming apparatus, thereby maintaining the quality and performance of consumables.

Implementation Method 1

a load element 2024, a switching element 2025, and a processor 2026. The load element 2024 controls a temperature of the authentication IC 202a with an electric current supplied to the load element 2024

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS11438479B2Semiconductor device, replacement part, and image forming apparatus
Publication Date: 2022.09.06 KYOCERA DOCUMENT SOLUTIONS INC
  • US11438479B2 patent drawing
  • US11438479B2 patent drawing
  • US11438479B2 patent drawing

AI summary

A semiconductor device includes a load element, a switching element, and a processor. The load element controls a temperature of the semiconductor device with an electric current supplied to the load element. The switching element switches between supply of an electric current to the load element and a cut-off of the supply. The processor controls the switching element. The processor controls the electric current to be supplied to the load element through the switching element so that the semiconductor device has a series of temperatures represented by a specific temperature profile.