Autoclavable Endoscope Electronics Using Flexible PCB
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Solution Overview
Problem
Existing endoscope electronics units in non-hermetic spaces are vulnerable to moisture and high temperatures during autoclaving, leading to potential damage and loss of functionality due to the use of rigid FR4 printed circuit boards and protective housings that consume space and require additional insulation materials.
Innovation Solution
A multi-layer printed circuit board with a reinforced rigid region and flexible region, coated with epoxy resin and sealed with silicone, allowing for flexible installation and protection against moisture, featuring a reduced feedthrough and nominal bending points for enhanced durability and signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid FR4 printed circuit board with a sheet metal housing is used to protect electronic components from moisture, then protection against moisture is improved, but the installation space required increases and the casting process becomes time-consuming
Solution Approach 1:
The patent applies a flexible printed circuit board instead of a rigid FR4 board with a sheet metal housing. The flexible PCB can be bent and conform to the available installation space in the endoscope handle while still providing protection for electronic components through its inherent flexibility and ability to be sealed
Solution Approach 2:
The patent removes the separate sheet metal housing from the design. Instead of using a dedicated metal housing structure, the protection is achieved through the flexible PCB itself and its integration with the endoscope handle structure, eliminating the need for additional housing components
2Reliability
If a sheet metal housing filled with silicone material is used to protect the circuit against moisture, then protection against moisture is improved, but the casting process becomes very time-consuming
Solution Approach 1:
The patent eliminates the separate sheet metal housing and silicone filling process. The protection function is integrated directly into the flexible PCB structure, which can be manufactured as a single piece or with minimal assembly steps, dramatically reducing production time
Solution Approach 2:
The patent combines the housing function and circuit board function into a single integrated flexible PCB structure. This merging eliminates the need for separate manufacturing processes for the housing and circuit board, streamlining production
3Strength
If a metal housing is used for electrical insulation, then structural protection is improved, but additional insulating housing material is required which increases installation space
Solution Approach 1:
The patent uses a flexible printed circuit board that provides both structural protection and electrical insulation in a single component. The flexible PCB can be made with sufficient thickness and material properties to provide the needed protection without requiring additional separate insulating materials
Solution Approach 2:
The patent employs composite material structures in the flexible PCB, combining conductive and non-conductive layers to achieve both electrical insulation and structural protection. This allows the single component to fulfill multiple functions that would traditionally require separate parts
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, durable, and functional electronics unit that withstands autoclaving without additional housing, maintaining electrical insulation and signal quality while reducing installation space and preventing moisture ingress.
Implementation Method 1
the epoxy material is an electrical insulator
Implementation Method 2
the rigid region can be coated with an epoxy resin which itself, particularly after curing, has a high viscosity or inflexibility
Implementation Method 3
The flexible region of the printed circuit board can be sealed with a silicone material
Implementation Method 4
the epoxy resin can be filled with a ceramic powder in an embodiment, such that, in terms of its thermal and mechanical properties, the material is adapted to the housing of the electronic components
Data Source
AI summary
An autoclavable electronics unit for an endoscope, the autoclavable electronics unit including: a multi-layer printed circuit board having a rigid region and a flexible region, the rigid region being reinforced by stiffener material to have a greater rigidity than the flexible region and the flexible region is configured to be bendable. Where the multi-layer printed circuit board is formed from structured layers made of conductive and non-conductive materials adhered together, in which the conductive structures form conductor tracks and contact surfaces; the rigid region is provided with one or more electronic components; and the rigid region is covered by an epoxy resin.