Automated Copper Vertical Launch Fabrication for Fine-Feature PCBs
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Solution Overview
Problem
Conventional printed circuit board (PCB) manufacturing processes are labor-intensive, costly, and limited in producing small feature sizes, which restricts the range of frequencies that RF and electromagnetic circuits can support, and lack automation in creating copper vertical launches (CVLs) for interconnections.
Innovation Solution
An automated apparatus and method for fabricating copper vertical launches within PCBs using a feed mechanism to extrude and cut copper wire, integrate a wire cutting and gripping mechanism for secure solder joints, and a PCB reflow pre-heater for soldering, enabling automated assembly and reducing labor and costs while supporting higher frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional PCB manufacturing processes are used, then manufacturing experience and established processes are available, but the processes are labor-intensive, costly, and limited in producing small feature sizes
Solution Approach 1:
The patent replaces manual mechanical cutting and soldering operations with automated machinery. The wire cutting and gripping mechanism automatically cuts copper wire to precise lengths and positions it, while the reflow soldering apparatus automatically solders the wire to the PCB trace, eliminating labor-intensive manual operations and enabling production of small feature sizes with high precision
Solution Approach 2:
The patent changes the manufacturing parameters by using automated control systems that precisely control cutting length, wire position, and soldering temperature. This enables production of small feature sizes (high manufacturing precision) while maintaining high productivity through automated parameter control rather than manual adjustment
2Productivity
If conventional PCB manufacturing processes are used, then established manufacturing methods are available, but turnaround time is slow and costs are high
Solution Approach 1:
The patent segments the manufacturing process into distinct automated modules: wire feeding, cutting, gripping, positioning, and reflow soldering. Each module performs a specific function automatically, reducing overall manufacturing time while the integrated system manages the complexity through modular design
Solution Approach 2:
The automated wire cutting and gripping mechanism automatically feeds wire, cuts it to length, positions it, and prepares it for soldering without manual intervention. The reflow soldering apparatus automatically heats and solders the wire, making the process self-service and eliminating labor-intensive steps, thereby reducing turnaround time
3Manufacturing precision
If automated wire cutting and gripping is implemented, then labor is reduced and precision is improved, but device complexity increases
Solution Approach 1:
The wire cutting and gripping mechanism is designed as a multi-functional apparatus that performs wire feeding, cutting to precise lengths, gripping, and positioning in a single integrated system. This universal device handles multiple operations that would otherwise require separate tools, improving wire placement precision while managing device complexity through consolidation of functions
Solution Approach 2:
The patent merges the wire cutting mechanism and gripping mechanism into a single integrated apparatus. The cutting device and gripper work together in coordination, with the gripper immediately securing the wire after cutting. This merging improves precision by ensuring accurate wire length and positioning while managing complexity through integrated design rather than separate operations
4Reliability
If copper wire is used for vertical launches, then interconnection reliability is improved, but automated installation complexity increases
Solution Approach 1:
The patent replaces manual wire installation and soldering with automated machinery. The wire cutting and gripping mechanism automatically installs copper wire vertical launches, and the reflow soldering apparatus automatically solders the wire to PCB traces, ensuring reliable connections while managing installation automation complexity through integrated automated systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of compact, low-profile electromagnetic circuits capable of supporting frequencies up to 300 GHz, reduces labor and costs, and increases the reliability of connections, facilitating the integration of copper wires into 3D printed parts and eliminating the need for wet plating processes.
Implementation Method 1
The vacuum device may be connected to a vacuum source to provide the suction required to move the waste
Implementation Method 2
an integrated heated gripper device to receive the copper wire from the feed mechanism, cut and secure a segment of copper wire
Implementation Method 3
a hot plate configured to raise a temperature of the PCB to just under a reflow temperature
Implementation Method 4
solder an end of the segment of copper wire to a signal trace of the PCB
Data Source
AI summary
An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.