Automated Semiconductor Assembly System for Power Disc Devices
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Solution Overview
Problem
Conventional processes for manufacturing power disc devices with semiconductor and non-semiconductor parts are manual, leading to inefficiencies, inaccuracies, and high reject rates due to the handling and assembly steps, which are slow and prone to errors.
Innovation Solution
A fully automated system integrating a front end semiconductor processing station with etching and testing, a back end device assembly station for stacking and passivation, and a robotic transfer system to handle and transfer semiconductor parts, reducing manual handling and improving productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual processes are used for handling and assembling semiconductor parts, then flexibility and adaptability are maintained, but productivity is low and reject rates are high
Solution Approach 1:
The system enables self-service through automated handling where the semiconductor part is automatically transferred between processing stations without manual intervention. The transfer device with gripper mechanically manipulates the part through etching, testing, and assembly stations, allowing the system to serve itself rather than requiring human operators for each step.
Solution Approach 2:
Manual mechanical handling is replaced with an automated mechanical transfer device. The robot arm with gripper substitutes human hands for manipulating semiconductor parts, eliminating manual dexterity requirements while increasing precision and speed. This mechanical substitution enables consistent, repeatable operations at higher velocities.
2Manufacturing precision
If manual assembly steps are used, then process flexibility is maintained, but manufacturing precision and quality consistency deteriorate
Solution Approach 1:
Multiple discrete manual operations are merged into an integrated automated system. The transfer device combines etching, testing, and assembly functions in a single coordinated workflow, eliminating the need for separate manual workstations. This merging ensures consistent positioning and handling throughout the entire process, improving precision while managing complexity through unified control.
Solution Approach 2:
The system incorporates feedback mechanisms where test results from the testing station directly influence subsequent assembly operations. The automated transfer device receives information about part quality and adjusts handling accordingly, ensuring that only properly tested components proceed to assembly. This closed-loop feedback maintains high manufacturing precision by preventing defective parts from advancing.
3Reliability
If automated transfer device is introduced, then productivity and quality are improved, but device complexity and initial cost increase
Solution Approach 1:
The transfer device is designed with multi-functionality to perform multiple operations: gripping the semiconductor part, transferring it between stations, positioning it for etching, and moving it for assembly. This universal device replaces several specialized manual tools and workstations, reducing overall system complexity despite the advanced capabilities of the single transfer device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The automated system enhances productivity, reduces reject rates, and ensures high-quality production by eliminating manual handling errors and providing real-time monitoring and control, resulting in stable processing and improved quality management.
Implementation Method 1
an etching station configured to etch an edge of a semiconductor disc
Implementation Method 2
a heating station configured to receive the passivated stack and to heat the stack
Data Source
AI summary
A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.